FMEN-2208

Diode Arrays Overview

The FMEN-2208 is an 80 V, 20 A Schottky diode designed to improve VF and IR characteristics for enhanced power supply efficiency in high-frequency systems. It features a typical forward voltage drop of 0.73 V at 10 A and a maximum reverse leakage current of 200 µA at 80 V. The device operates within a junction temperature range of -40 to 150 °C with a thermal resistance of 4.0 °C/W. Packaged in TO220F-3L, it supports a nonrepetitive peak reverse voltage of 80 V and a surge forward current of 120 A.

Diode Arrays Feature Summary

• Optimized forward voltage and reverse leakage characteristics for improved system efficiency
• High-speed switching capability suitable for high-frequency applications
• Robust thermal performance with low junction-to-case thermal resistance

Diode Arrays Applications

• DC-DC converters
• Adapters
• High speed switching applications

Diode Arrays Procurement Notes

Verify the specific datasheet revision (e.g., Rev.2.2) matches your design requirements before procurement. Confirm that the bare lead frame is Pb-free and RoHS compliant as specified. Ensure the application environment adheres to the absolute maximum ratings, particularly regarding case temperature derating curves for average forward current. Contact Sanken Electric sales representatives for any applications requiring higher reliability or specific usage confirmations.

Diode Arrays Selection Notes

Select the FMEN-2208 when designing high-frequency systems requiring efficient rectification with low conduction losses. Consider its 80 V rating and 20 A continuous current capacity against your circuit's peak and average load requirements. Evaluate the thermal management strategy using the provided derating curves to ensure the junction temperature remains within the -40 to 150 °C operating range under expected load conditions.

Diode Arrays Part Context

The FMEN-2208 belongs to Sanken Electric's Schottky diode portfolio, specifically engineered for general-purpose electronic equipment. It utilizes a TO220F-3L package with a bare lead frame, facilitating effective heat dissipation through direct mounting. This component is intended for use in home appliances, office equipment, and telecommunications gear, offering a balance of electrical performance and thermal stability for standard industrial and consumer electronics applications.

Diode Arrays Replacement Considerations

No public confirmed substitute part numbers are available in the documentation.

Diode Arrays FAQ

What is the maximum reverse leakage current at elevated temperatures?

The maximum reverse leakage current under high temperature conditions (TJ = 150 °C) is 100 mA.

Is the FMEN-2208 suitable for aerospace or medical applications?

No, the FMEN-2208 is not intended for use in applications requiring extremely high reliability such as aerospace equipment, nuclear power control systems, or Class III medical devices.

What is the recommended soldering condition for this component?

For flow soldering, the limit is 270 °C for 7 seconds. For soldering iron use, the limit is 350 °C for 3.5 seconds. Soldering must be performed at least 1.5 mm from the body of the product.