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The FNA23060 is a Smart Power Module (SPM) from onsemi's Motion SPM 2 Series, designed for three-phase AC induction motor drives. It integrates Sense-IGBTs and FRFETs with high-voltage and low-voltage integrated circuits in a single package. The module features a 600 V collector-emitter voltage rating and a continuous collector current of 30 A. It utilizes a Direct Copper Bond (DBC) substrate to minimize thermal resistance and includes built-in thermistors for temperature monitoring.
Verify the specific datasheet revision and ordering suffix when sourcing. Confirm that the required thermal interface material matches the DBC substrate specifications. Ensure the gate drive circuitry aligns with the integrated HVIC/LVIC requirements. Check for any recent Process Change Notifications regarding pinout or electrical characteristics updates before finalizing the bill of materials.
Select this component for designs requiring a compact solution for 600 V, 30 A three-phase motor control. The integrated nature reduces external component count compared to discrete IGBT solutions. Consider the thermal performance provided by the DBC substrate for heat dissipation needs. Verify that the operating temperature range meets the application environment constraints.
This part belongs to the Motion SPM 2 Series, which targets low-side applications up to 75 A at 600 V. The series aims to accelerate design speed and increase reliability by combining power devices with control logic. It serves as an alternative to discrete IGBT assemblies in industrial and consumer motor drive markets.
The FNA21012A offers similar integration but with a lower 10 A current rating. The FNA23512A provides a higher 35 A rating but operates at a 1200 V voltage level. The FNA25060 is a direct current upgrade within the same voltage class, offering 50 A capacity.