FNB80460T3-01

Overview

The FNB80460T3-01 is a Motion SPM module manufactured by onsemi, designed for motor control applications. It integrates IGBT logic and supports multiphase stepper motors as well as brushless DC (BLDC) motors. The component operates within a junction temperature range of -40°C to 150°C. It utilizes a 25-PowerDIP package with offset leads and is intended for through-hole mounting.

Feature Summary

• Integrates IGBT logic for efficient motor driving
• Supports both multiphase stepper and BLDC motor types
• High thermal tolerance for demanding environments

Applications

• Brushless DC (BLDC) motor drives
• Multiphase stepper motor control systems

Procurement Notes

Verify the obsolete status of this specific part number before design finalization. Confirm that the 25-PowerDIP offset lead package matches your PCB footprint requirements. Ensure the operating temperature range meets your system's thermal constraints. Check for available replacement modules from the manufacturer's current portfolio.

Selection Notes

Select this module when integrating IGBT-based solutions for stepper or BLDC motors are required. Consider the high junction temperature rating for robust operation. Evaluate the physical dimensions of the 25-PowerDIP package against board space limitations. Verify compatibility with existing gate drive circuitry if not fully integrated.

Part Context

This component belongs to the Motion-SPM series from onsemi, which focuses on integrated power modules for motion control. The series typically combines power switches with control logic to simplify motor driver designs. This specific model targets industrial and consumer applications requiring reliable motor actuation.

Replacement Considerations

The datasheet indicates the FNB80460T3 is obsolete. Review official substitution guides for compatible Motion-SPM modules. Ensure any replacement maintains the same pinout and electrical characteristics for seamless integration.