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FOD0738 is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is OPTOISO 2.5KV 2CH PUH PULL 8SOIC. Review the specifications below when checking this part for your BOM.
The FOD0738 is a logic output optocoupler manufactured by Fairchild Semiconductor, now part of ON Semiconductor. It consists of an AlGaAs light-emitting diode optically coupled to a high-speed transimpedance amplifier and voltage comparator. The device provides dual-channel isolation with a propagation delay of 60ns and rise/fall times of 12ns/8ns respectively. It features a push-pull, totem pole output configuration capable of 15MBd data rates. Electrical isolation is rated at 2500Vrms with a common-mode rejection of 25kV/µs. The component is housed in an 8-SOIC package.
Verify the manufacturer designation as Fairchild Semiconductor or ON Semiconductor depending on the production date and supply chain status. Confirm the specific suffix variants such as FOD0738R1 or FOD0738R2 if reel packaging is required. Ensure the datasheet version matches the procurement batch for accurate electrical parameter validation.
Select this component when high-speed isolation is required for logic signals. The 2500Vrms isolation rating suits general industrial applications. Consider the 60ns propagation delay for timing-critical circuits. Compare against single-channel alternatives if only one isolated path is needed. Verify input current requirements match the driving source capabilities.
The FOD0738 belongs to the FOD0708/FOD0738 family of high-speed optocouplers. These devices utilize AlGaAs LED technology for efficient optical coupling. The series is designed for applications requiring fast response times and robust noise immunity. It complements slower optocouplers by offering megabit-per-second data rates within a standard surface-mount package.
Public confirmed substitute part numbers include FOD0738R1 and FOD0738R2. These variants maintain identical electrical characteristics but differ in packaging configurations. Direct cross-replacement requires verifying pinout compatibility and thermal performance under similar load conditions.
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