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FOD817B3S
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Product Detailed Parameters
- Description：OPTOISOLATOR 5KV 1CH TRANS 4-SMD
- Series：-
- Mfr：onsemi
- Package：Tube
- Number of Channels：1
- Voltage - Isolation：5000Vrms
- Current Transfer Ratio (Min)：130% @ 5mA
- Current Transfer Ratio (Max)：260% @ 5mA
- Turn On / Turn Off Time (Typ)：-
- Rise / Fall Time (Typ)：4µs, 3µs
- Input Type：DC
- Output Type：Transistor
- Voltage - Output (Max)：70V
- Current - Output / Channel：50mA
- Voltage - Forward (Vf) (Typ)：1.2V
- Current - DC Forward (If) (Max)：50 mA
- Vce Saturation (Max)：200mV
- Operating Temperature：-55°C ~ 110°C
- Mounting Type：Surface Mount
- Package / Case：4-SMD, Gull Wing
- Supplier Device Package：4-SMD
- Grade：-
- Qualification：-
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Overview
The FOD817B3S is a surface-mount transistor output optocoupler from onsemi's FOD series. It features a single channel with an NPN phototransistor output in a 4-lead SMD package. Key electrical parameters include a minimum current transfer ratio of 130% at 5mA input, isolation voltage of 5000Vrms, and maximum collector current of 50mA. The device supports a maximum forward current of 50mA with a typical forward voltage of 1.4V. Operating temperature range spans from -55°C to +110°C.
Feature Summary
- Provides high-voltage isolation between input and output circuits via optical transmission
- Features a compact surface-mount design suitable for automated assembly processes
- Delivers reliable signal coupling with standardized pin configuration for legacy replacements
Applications
- Industrial control systems requiring galvanic isolation
- Power supply feedback loops for voltage regulation
- Signal interfacing between microcontrollers and high-voltage loads
Procurement Notes
Verify the specific suffix '3S' confirms the surface-mount variant distinct from through-hole equivalents. Confirm RoHS compliance status and lead-free soldering compatibility during component sourcing. Ensure packaging type matches production requirements, as tape-and-reel options may differ from standard tube distributions. Cross-reference datasheet revisions to validate parameter consistency across manufacturing batches.
Selection Notes
Select this component when surface-mount technology is required for space-constrained designs. Compare current transfer ratio specifications against circuit gain requirements to ensure adequate switching performance. Evaluate thermal management needs given the operating temperature limits. Consider package dimensions and footprint compatibility with existing PCB layouts before finalizing the selection.
Part Context
This part belongs to the widely adopted FOD817 family, which serves as a standard solution for general-purpose optoisolation. The FOD817B3S specifically adapts the popular DIP-4 form factor into a surface-mount configuration. This allows designers to maintain functional equivalence with traditional through-hole designs while utilizing modern SMD assembly techniques.
Replacement Considerations
Direct pin-compatible substitutes include other manufacturers' 4-pin SMD transistor output optocouplers with matching isolation ratings. Verify that alternative parts meet the same 5000Vrms isolation and 50mA collector current specifications. Check current transfer ratio ranges to ensure equivalent signal transmission characteristics.
