FOD817DSD

Overview

The FOD817DSD is a single-channel phototransistor optocoupler from onsemi’s FOD series, designed for surface-mount applications. It features a 4-PDIP-GW (SMD-4) package with鸥翼 leads. Key electrical parameters include a maximum forward current of 50 mA and a typical forward voltage of 1.2 V. The device offers high isolation capability with 5000Vrms isolation voltage. Output characteristics specify a collector-emitter saturation voltage of 200 mV max and a collector current of 50 mA. Current transfer ratio ranges from 300% to 600% at 5 mA input. Switching times are rapid, with typical rise and fall times of 4 µs and 3 µs respectively. Operating temperature spans -55°C to 110°C.

Feature Summary

• Provides high-voltage isolation between input and output circuits
• Features fast switching performance with microsecond-level response times
• Supports wide operating temperature range for industrial environments

Applications

• General-purpose signal isolation in digital communication interfaces
• Power supply feedback loops for voltage regulation
• Industrial control systems requiring galvanic separation

Procurement Notes

Verify the specific suffix DSD confirms the surface-mount 4-PDIP-GW package configuration. Ensure procurement matches the required current transfer ratio bin if strict gain consistency is needed. Confirm RoHS compliance status for environmental regulations. Check moisture sensitivity level handling requirements during storage and assembly processes.

Selection Notes

Select this component when surface-mount space constraints require a compact 4-pin footprint instead of traditional DIP packages. Choose based on the need for faster switching speeds compared to standard FOD817 variants. Consider the 5000Vrms isolation rating for safety-critical applications. Verify that the NPN phototransistor output type aligns with the load interface requirements.

Part Context

This part belongs to the FOD817 family of 4-pin phototransistor optocouplers manufactured by onsemi. While the base FOD817 typically denotes through-hole MDIP packaging, the DSD suffix specifically identifies the surface-mount variant with lead bends. It shares core functional similarities with other FOD817 models but differs in physical mounting style and potentially minor electrical tolerances defined by the datasheet.

Replacement Considerations

FOD817DS is a direct equivalent surface-mount variant within the same product line.