FODM8801BR2

Overview

The FODM8801BR2 is a single-channel transistor output optocoupler from the OptoHiT series, manufactured by onsemi. It features an NPN phototransistor output housed in a compact 4-Mini-Flat surface-mount package. The device provides high isolation voltage of 3750 Vrms and supports a wide operating temperature range from -40°C to +125°C. Key electrical parameters include a maximum collector-emitter voltage of 75V, a peak forward current of 20mA, and a typical rise/fall time of 5µs/5.5µs. The current transfer ratio ranges from 130% to 260%, ensuring reliable signal transmission in industrial applications.

Feature Summary

• High-temperature operation capability up to 125°C for robust performance
• Compact 4-pin Mini-Flat surface-mount package design
• High insulation voltage rating of 3750 Vrms for safety isolation
• Fast switching speed with typical 5µs rise and fall times

Applications

• Industrial process control systems requiring galvanic isolation
• Power supply feedback loops for voltage regulation
• General-purpose digital signal isolation interfaces
• Microcontroller input/output protection circuits

Procurement Notes

Verify the specific suffix 'R2' corresponds to the tape-and-reel packaging configuration when ordering. Confirm that the required current transfer ratio bin aligns with your circuit design specifications, as variations exist within the OptoHiT family. Ensure compatibility with standard SMT reflow profiles suitable for the Mini-Flat package type during assembly planning.

Selection Notes

Select this component when a small footprint and high-temperature stability are critical for the application. Compare the 130%-260% CTR range against system requirements to ensure adequate noise margin. Consider the 75V collector-emitter voltage limit for load driving capabilities. Evaluate the 3750 Vrms isolation barrier against regulatory safety standards applicable to the end product environment.

Part Context

The FODM8801BR2 belongs to onsemi's OptoHiT series, which utilizes advanced process technology to enhance thermal performance and reliability. This series is designed to replace older generation optocouplers in space-constrained designs. The Mini-Flat package offers a smaller profile compared to traditional SOIC packages while maintaining similar electrical characteristics and isolation ratings.

Replacement Considerations

Direct replacements may include other variants within the FODM8801 series such as FODM8801C or FODM8801A, depending on the required current transfer ratio bin. Verify pinout compatibility and package dimensions before substitution. Ensure that alternative parts meet the same 125°C operating temperature requirement and 3750 Vrms isolation rating.