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Product Detailed Parameters
- Description：Rockchip RK3568SOM, 2GB DDR4, 16
- Series：-
- Mfr：Forlinx Embedded
- Package：Bulk
- Module/Board Type：MPU
- Core Processor：ARM® Cortex®-A55
- Co-Processor：-
- Speed：2.0GHz
- Flash Size：16GB eMMC
- RAM Size：2GB
- Connector Type：Board-to-Board (BTB)
- Size / Dimension：1.770" L x 2.756" W (45.00mm x 70.00mm)
- Operating Temperature：0°C ~ 80°C
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Overview
The Forlinx FET3568-C is an embedded core board based on the Rockchip RK3568 processor, featuring a quad-core Cortex-A55 architecture with a maximum frequency of 2.0 GHz. The specific configuration includes 16GB LPDDR4X RAM and 256GB eMMC storage. It integrates a 1 TOPS NPU, Mali-G52 GPU, and hardware video decoding capabilities up to 4K resolution. The module supports multiple operating systems including Linux, Android, and OpenHarmony, utilizing a 4x80-pin board-to-board connector interface.
Feature Summary
- RK3568 Processor: Quad-core Cortex-A55 at 2.0GHz with 1TOPS NPU for edge AI inference.
- High Capacity Memory: Configured with 16GB LPDDR4X RAM and 256GB eMMC storage.
- Multi-Display Support: Interfaces include HDMI 2.0, MIPI-DSI, LVDS, and eDP, supporting simultaneous multi-screen output.
- Rich Connectivity: Features dual Gigabit Ethernet, USB 3.0, PCIe 3.0, and SATA 3.0 interfaces.
Applications
- Industrial automation and control systems
- Smart IoT gateways and edge computing devices
- Medical equipment and healthcare displays
- Digital signage and smart retail terminals
Procurement Notes
Verify the exact memory and storage configuration against the suffix code, as the base model offers variable RAM/ROM options. Confirm the operating temperature range (commercial vs. industrial) required for the deployment environment. Ensure carrier board design accommodates the 0.5mm pitch 4x80Pin connector specifications for reliable signal integrity.
Selection Notes
Select this model for applications requiring balanced performance and high storage capacity for local data processing. The 16GB RAM variant is suitable for complex Linux environments or multitasking AI workloads. Compare against the FET3568J-C if extended industrial temperature ranges (-40℃ to +85℃) are mandatory, as standard C models typically operate within 0℃ to +80℃.
Part Context
This component belongs to the Forlinx FET3568 series, designed around the Rockchip RK3568 SoC. It serves as a compact system-on-module solution, decoupling the core processing unit from peripheral I/O via a carrier board. This architecture simplifies product development cycles while maintaining high reliability through rigorous environmental testing.
Replacement Considerations
Direct functional replacements within the same form factor are limited due to proprietary connector layouts. Consider the FET3568J-C for identical electrical performance but with verified industrial-grade temperature ratings. For higher performance needs, the FET3588-C offers significantly greater NPU and CPU capabilities but requires different carrier board design considerations.
