FORLINX-FETMX9352-C+151GSE8GIB11

Overview

The Forlinx Embedded FET-MX9352-C is an industrial System-on-Module (SoM) based on the NXP i.MX9352 processor. It features a heterogeneous multi-core architecture with dual Cortex-A55 cores operating at 1.7GHz and a single Cortex-M33 real-time core running at 250MHz. The module integrates an Arm Ethos U65 microNPU providing 0.5 TOPS of AI acceleration. Standard configuration includes 1GB LPDDR4 RAM and 8GB eMMC storage. Designed for harsh environments, it utilizes industrial-grade components to support operation from -40°C to +85°C. The compact 48×33mm form factor connects via a 2×100-pin board-to-board connector.

Feature Summary

• Heterogeneous Multi-Core Architecture: Combines dual Cortex-A55 application cores with a dedicated Cortex-M33 real-time control core.
• Integrated AI Acceleration: Equipped with Arm Ethos U65 microNPU delivering 0.5 TOPS performance for edge machine learning tasks.
• Industrial Durability: Constructed with industrial-grade capacitors, resistors, and connectors rated for -40°C to +85°C operating temperatures.
• High-Speed Connectivity: Supports up to two Gigabit Ethernet interfaces, including one with Time-Sensitive Networking (TSN) capabilities.

Applications

• Industrial automation and factory floor control systems
• Predictive maintenance and smart visual inspection equipment
• Vehicle-mounted digital information terminals
• Environmental monitoring stations

Procurement Notes

Verify the specific revision level of the i.MX9352 SoC, as commercial and industrial variants may differ in clock speeds. Confirm that the carrier board design accommodates the 2×100-pin connector specifications (0.4mm pitch, 1.5mm height). Ensure software development environments align with the supported Linux kernel versions (5.15.52 or 6.1.36) and Qt frameworks provided by the manufacturer.

Selection Notes

Select this module when deterministic real-time control is required alongside complex Linux-based applications, leveraging the separate Cortex-M33 core. It is suitable for space-constrained designs due to its 48×33mm footprint. Consider the 0.5 TOPS NPU capability if lightweight inference models are needed. Verify thermal management requirements for the -40°C to +85°C range if deploying in enclosed industrial enclosures.

Part Context

This module is part of the FET series from Forlinx Embedded, designed around the NXP i.MX 93x processor family. The i.MX9352 represents a crossover processor combining application processing with real-time control. The product line emphasizes long-term supply stability, with NXP committing to a 15-year lifecycle for the underlying silicon.

Replacement Considerations

For higher performance needs within the same ecosystem, consider the FET-MX9596-C, which features six Cortex-A55 cores and a Cortex-M7 core. For simpler single-core applications, the FETMX91xx-C series offers a Cortex-A55 solution. Cross-compatibility with carrier boards requires verification of pin mapping differences between the 100-pin connector standards used across different Forlinx modules.