FS100R12PT4BOSA1

$117.24

Description：IGBT MOD 1200V 135A 500W
Series：EconoPACK™ 4

SKU:792eb633d4b6 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MOD 1200V 135A 500W
Series：EconoPACK™ 4
Mfr：Infineon Technologies
Package：Tray
IGBT Type：Trench Field Stop
Configuration：Three Phase Inverter
Vce(on) (Max) @ Vge, Ic：2.15V @ 15V, 100A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：135 A
Power - Max：500 W
Current - Collector Cutoff (Max)：1 mA
Input Capacitance (Cies) @ Vce：6.3 nF @ 25 V

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FS100R12PT4BOSA1

Overview

The FS100R12PT4BOSA1 is an IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology and Emitter Controlled 4 diodes. It features a PressFIT connection system and includes an integrated NTC thermistor. The module operates with a collector-emitter voltage of 1200 V and a nominal continuous DC collector current of 100 A at 90°C case temperature. It supports a repetitive peak collector current of 200 A and extends the operating junction temperature up to 150°C.

Feature Summary

Integrates fast Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode technologies for optimized switching performance.
Features a PressFIT terminal design that eliminates solder joints to enhance mechanical robustness and thermal cycling capability.
Includes an isolated base plate constructed with copper material and internal Al2O3 basic insulation.
Incorporates an NTC thermistor for precise real-time monitoring of module temperature.

Applications

High power converters
Motor drives
UPS systems

Procurement Notes

Verify the specific BOSA1 suffix against official documentation to confirm exact manufacturing lot details or regional compliance variations. Confirm the component status as preliminary data may require validation against final production specifications before committing to long-term supply agreements.

Selection Notes

Select this module for applications requiring high reliability under thermal stress due to the PressFIT interconnection method. Ensure the cooling system maintains the case temperature within limits to support the 100 A continuous current rating. Verify gate drive requirements align with the specified threshold and internal resistance values.

Part Context

This component belongs to the EconoPACK™4 series manufactured by Infineon Technologies. It represents the fourth generation of Trench/Fieldstop IGBT technology, designed to balance low conduction losses with efficient switching characteristics in industrial power electronics environments.