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Product Detailed Parameters
- Description：IGBT MODULES
- Series：*
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The FS400R12A2T4BOSA1 is a Trenchstop IGBT4 technology module manufactured by Infineon Technologies. It features a HybridPack2 package with a nominal collector current of 400 A and a maximum voltage rating of 1200 V. The typical saturated collector-emitter voltage (VCE(sat)) is 1.75 V at 25°C junction temperature, while the antiparallel diode forward voltage (VF) is typically 1.9 V under the same conditions. The module supports a maximum operating junction temperature of 150°C and is designed for industrial applications requiring robust power switching capabilities.
Feature Summary
- Incorporates Trenchstop IGBT4 technology to optimize conduction and switching losses for improved efficiency.
- Utilizes the HybridPack2 press-fit package design to facilitate automated assembly and ensure reliable mechanical connection.
- Integrates an antiparallel fast recovery diode within the half-bridge configuration for complete phase leg functionality.
Applications
- Industrial motor drives and servo systems
- Uninterruptible power supplies (UPS)
- Induction heating equipment
Procurement Notes
Verify the specific ordering suffix BOSA1 against official Infineon documentation to confirm moisture sensitivity classification and RoHS compliance status. Ensure that procurement channels provide valid traceability data consistent with the manufacturer's quality standards for industrial-grade components.
Selection Notes
Select this component when a 1200 V, 400 A half-bridge solution in a HybridPack2 form factor is required. Confirm that the thermal management system can handle the specified power dissipation at the target operating frequency. Verify compatibility with press-fit mounting infrastructure on the printed circuit board.
Part Context
This part belongs to the Infineon Trenchstop IGBT4 product family, which balances low conduction losses with robust short-circuit withstand capability. The HybridPack2 series provides a compact, high-power density packaging option suitable for space-constrained industrial power electronics designs.
Replacement Considerations
Consult official cross-reference lists for direct replacements. Consider modules from the same Trenchstop IGBT4 family with identical pinout and thermal characteristics if sourcing constraints exist.
