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Product Detailed Parameters
- Description：FS520R12A8P1LBHPSA1
- Series：HybridPACK™
- Mfr：Infineon Technologies
- Package：Box
- IGBT Type：-
- Configuration：3 Independent
- Vce(on) (Max) @ Vge, Ic：1.58V @ 15V, 300A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：300 A
- Power - Max：1 kW
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：24600 pF @ 25 V
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Overview
The FS520R12A8P1LBHPSA1 is a HybridPACK Drive G2 six-pack IGBT module rated at 1200 V and 520 A. It features an EDT1200 technology with a maximum collector-emitter voltage of 1200 V, a nominal current of 520 A, and a repetitive peak current of 1040 A. The saturation voltage is typically 1.48 V at 300 A and 25°C. Operating junction temperature reaches 175°C. It includes an integrated on-chip temperature sensor and utilizes direct-cooled PinFin base plate technology for high power density.
Feature Summary
- Compact six-pack design optimized for hybrid and electric vehicles
- Direct-cooled PinFin base plate for enhanced thermal performance
- Integrated on-chip temperature sensor for thermal monitoring
- PressFIT contact technology for reliable PCB assembly
Applications
- (Hybrid) electrical vehicles (H)EV traction inverters
- Motor drives
- Commercial, construction and agricultural vehicles (CAV)
Procurement Notes
Verify the specific ordering suffix against official Infineon documentation to confirm exact mechanical or electrical variants. Ensure compliance with AQG 324 automotive qualification standards required for the target application environment. Confirm that the selected variant matches the intended system requirements before finalizing procurement orders.
Selection Notes
Select this module based on its 1200 V rating and 520 A current capacity suitable for EV traction applications. Consider the low switching losses and low gate charge for efficiency optimization. Verify compatibility with the HybridPACK Drive G2 footprint and cooling interface requirements for the specific inverter design.
Part Context
This component belongs to the Infineon HybridPACK Drive G2 family, designed for high-power density traction inverters. It combines silicon IGBT technology with advanced packaging to support scalable power solutions for electric mobility. The series targets next-generation vehicle platforms requiring robust performance and compact form factors.
Replacement Considerations
Consult official Infineon cross-reference guides for verified substitutes within the HybridPACK Drive G2 lineup. Ensure any replacement maintains identical pinout, thermal resistance, and insulation coordination specifications to guarantee system compatibility without redesign.
