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FSA3157L6X
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Product Detailed Parameters
- Description：IC SWITCH SPDTX1 15OHM 6MICROPAK
- Series：-
- Mfr：onsemi
- Package：Tape & Reel (TR),Cut Tape (CT)
- Switch Circuit：SPDT
- Multiplexer/Demultiplexer Circuit：2:01
- On-State Resistance (Max)：15Ohm
- Channel-to-Channel Matching (ΔRon)：150mOhm
- Voltage - Supply, Single (V+)：1.65V ~ 5.5V
- Voltage - Supply, Dual (V±)：-
- Switch Time (Ton, Toff) (Max)：5.7ns, 3.8ns
- -3db Bandwidth：250MHz
- Charge Injection：7pC
- Channel Capacitance (CS(off), CD(off))：6.5pF
- Current - Leakage (IS(off)) (Max)：100nA
- Crosstalk：-54dB @ 10MHz
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：6-UFDFN
- Supplier Device Package：6-MicroPak
- Number of Circuits：1
- Grade：-
- Qualification：-
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Overview
The FSA3157L6X is a single-pole/double-throw (SPDT) analog switch fabricated using advanced sub-micron CMOS technology. It operates within a supply voltage range of 1.65 V to 5.5 V, supporting rail-to-rail signal handling. The device features a maximum on-resistance of less than 10 Ω at 3.3 V and a 3 dB bandwidth of 250 MHz. Key timing parameters include a maximum propagation delay of 3.5 ns and a maximum power-down leakage current of 1 µA. It utilizes a MicroPak-6 surface-mount package with dimensions of 1.45 x 1 x 0.5 mm and functions across an operating temperature range of -40 °C to +85 °C.
Feature Summary
- Break-before-make select circuitry prevents signal disruption during switching transitions.
- Control input tolerates voltages up to 7.0 V independent of the VCC operating range.
- Ultra-small MicroPak leadless package provides space-saving surface mount capability.
Applications
- Analog and digital signal routing in portable devices
- Audio signal switching for mobile phones and media players
- Bus switching applications requiring low voltage operation
Procurement Notes
Verify component authenticity through authorized distribution channels due to potential availability constraints. Confirm RoHS compliance status via official datasheets before integration. Check for end-of-life notices or production change notifications from onsemi to ensure long-term supply stability for manufacturing schedules.
Selection Notes
Select this component for designs requiring low voltage operation down to 1.65 V and high-speed signal integrity. Ensure the application benefits from the break-before-make feature to avoid signal glitches. Verify that the MicroPak-6 footprint aligns with PCB layout constraints and thermal requirements for the specific enclosure design.
Part Context
This part belongs to the TinyLogic family of low-voltage universal high-speed switches. It serves as a compact solution for signal multiplexing in space-constrained consumer electronics. The device bridges legacy Fairchild Semiconductor specifications with current onsemi product portfolios, maintaining compatibility with standard SPDT switching requirements.
Replacement Considerations
Direct substitutes may include other SPDT analog switches from the same family with compatible pinouts. Verify electrical parameter equivalence, particularly on-resistance and supply voltage ranges, when evaluating alternative components for redesign purposes.
