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FSA831L10X-F131 is listed in the Battery Management range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is USB2.0 HIGH-SPEED (480MBPS) CHAR. Review the specifications below when checking this part for your BOM.
The FSA831L10X is a low-power, high-speed analog switch manufactured by Fairchild Semiconductor. It features a triple-pole, double-throw (TPDT) configuration designed for mobile industry processor interface (MIPI) applications. The device operates within a voltage range of 1.65 V to 3.6 V and supports data rates exceeding 500 MHz. Key electrical characteristics include a typical on-resistance of 7.0 Ω and a low on-capacitance of 7.0 pF. It provides an 8 kV ESD rating per IEC 61000-4-2 and over 16 kV power/ground ESD protection. The component is housed in a 24-lead ultra-thin molded leadless package (UMLP) measuring 2.5 x 3.4 mm.
Verify the specific suffix 'F131' against official Fairchild documentation to confirm reel packaging and tape-and-reel specifications. Ensure the operating temperature range matches the -40°C to +85°C specification defined for the standard FSA831 series. Confirm RoHS compliance status through the manufacturer's current product status page before procurement.
Select this component when designing circuits requiring low capacitance for signals exceeding 500 MHz. The UMLP package is suitable for space-constrained mobile devices. Ensure the system voltage aligns with the 1.65 V to 3.6 V operational range. Consider the 8 kV ESD rating for robustness in portable electronics environments.
This part belongs to the FSA831 family of high-speed analog switches. It is specifically engineered for multimedia application processors (MAP) connecting to peripheral devices. The design facilitates easy routing of differential signals in compact PCB layouts common in modern smartphones and digital cameras.
Direct substitutes include other TPDT analog switches with comparable on-capacitance below 10 pF and compatible supply voltages. Verify pinout compatibility and package dimensions (2.5 x 3.4 mm UMLP) to ensure mechanical fit without redesigning the footprint.
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