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FSB50825AT is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists onsemi. Its product description is 250KV 3.6A 23PWRDIP MOD. Review the specifications below when checking this part for your BOM.
The onsemi FSB50825AT is a three-phase intelligent power module (IPM) belonging to the Motion SPM® 5 series. It integrates MOSFET switches with gate drive circuitry in a single package, rated for 250 V and 3.6 A. The device utilizes a 23-PowerDIP surface-mount package designed for compact motor control applications. Key electrical characteristics include an isolation voltage of 1500 Vrms between power and control circuits. This component is engineered for efficient integration in motion control systems requiring robust switching capabilities within a small footprint.
Verify current availability status as this component may be subject to end-of-life notices or discontinuation. Confirm that the specific tape-and-reel packaging matches your automated assembly equipment specifications. Ensure compliance with RoHS directives if required by your manufacturing standards. Cross-reference the exact suffix with official documentation to confirm pinout and thermal characteristics before finalizing procurement orders.
Select this module when designing three-phase motor drives requiring integrated protection features and reduced component count. The SPM® 5 architecture simplifies layout by combining power and logic functions. Consider the thermal performance of the PowerDIP package relative to your enclosure constraints. Verify that the 250 V rating aligns with your bus voltage requirements while maintaining adequate safety margins for transient events.
This part belongs to onsemi's Motion SPM® 5 family of intelligent power modules. These devices are specifically engineered for motor control applications, offering a high level of integration compared to discrete solutions. The series focuses on reducing design complexity and improving reliability by incorporating advanced gate drive technologies within a standardized package format suitable for industrial and consumer electronics.
Public records indicate that the base model FSB50825 has been discontinued. Designers should evaluate alternative IPMs from the same manufacturer or compatible third-party equivalents that match the 23-pin PowerDIP form factor and electrical ratings. Verify pin compatibility and thermal resistance values before substituting.
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