Power Driver Modules FSB50825AT product image

FSB50825AT

$5.15
  • Description:250KV 3.6A 23PWRDIP MOD
  • Series:Motion SPM® 5

SKU:d2b5b11bf4f5 Category: Brand:

  
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FSB50825AT is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists onsemi. Its product description is 250KV 3.6A 23PWRDIP MOD. Review the specifications below when checking this part for your BOM.

Power Driver Modules specifications for FSB50825AT

  • Description:250KV 3.6A 23PWRDIP MOD
  • Series:Motion SPM® 5
  • Mfr:onsemi
  • Package:Bulk,Tube
  • Type:MOSFET
  • Configuration:3 Phase Inverter
  • Current:3.6 A
  • Voltage:250 V
  • Voltage - Isolation:1500Vrms
  • Mounting Type:Through Hole
  • Package / Case:23-PowerDIP Module (0.748", 19.00mm)
  • Grade:-
  • Qualification:-

Power Driver Modules datasheet and documents for FSB50825AT

FSB50825AT

Power Driver Modules Overview

The onsemi FSB50825AT is a three-phase intelligent power module (IPM) belonging to the Motion SPM® 5 series. It integrates MOSFET switches with gate drive circuitry in a single package, rated for 250 V and 3.6 A. The device utilizes a 23-PowerDIP surface-mount package designed for compact motor control applications. Key electrical characteristics include an isolation voltage of 1500 Vrms between power and control circuits. This component is engineered for efficient integration in motion control systems requiring robust switching capabilities within a small footprint.

Power Driver Modules Feature Summary

  • Integrates three-phase MOSFETs with dedicated gate drivers for simplified motor drive design
  • Provides high-voltage isolation between power and control sections to enhance system safety
  • Utilizes a compact PowerDIP surface-mount package to minimize board space requirements

Power Driver Modules Applications

  • Brushless DC (BLDC) motor controllers
  • AC servo drive systems
  • Industrial automation motion control units

Power Driver Modules Procurement Notes

Verify current availability status as this component may be subject to end-of-life notices or discontinuation. Confirm that the specific tape-and-reel packaging matches your automated assembly equipment specifications. Ensure compliance with RoHS directives if required by your manufacturing standards. Cross-reference the exact suffix with official documentation to confirm pinout and thermal characteristics before finalizing procurement orders.

Power Driver Modules Selection Notes

Select this module when designing three-phase motor drives requiring integrated protection features and reduced component count. The SPM® 5 architecture simplifies layout by combining power and logic functions. Consider the thermal performance of the PowerDIP package relative to your enclosure constraints. Verify that the 250 V rating aligns with your bus voltage requirements while maintaining adequate safety margins for transient events.

Power Driver Modules Part Context

This part belongs to onsemi's Motion SPM® 5 family of intelligent power modules. These devices are specifically engineered for motor control applications, offering a high level of integration compared to discrete solutions. The series focuses on reducing design complexity and improving reliability by incorporating advanced gate drive technologies within a standardized package format suitable for industrial and consumer electronics.

Power Driver Modules Replacement Considerations

Public records indicate that the base model FSB50825 has been discontinued. Designers should evaluate alternative IPMs from the same manufacturer or compatible third-party equivalents that match the 23-pin PowerDIP form factor and electrical ratings. Verify pin compatibility and thermal resistance values before substituting.

FSB50825ATFSB50825AT
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