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FT813Q-T is listed in the Video Processing range at ChipApex. The manufacturer field lists Bridgetek Pte Ltd.. Its product description is IC VIDEO GRAPHIC CNTL 56VQFN. Review the specifications below when checking this part for your BOM.
The FT813Q-T is a video IC from the Bridgetek EVE series, designed for advanced embedded video engine applications. It features a 24-bit RGB display interface and integrated capacitive touch capability. The component supports a maximum resolution of 800 x 600 pixels and utilizes an SPI interface for communication. Operating within a voltage range of 1.62 V to 3.63 V, it functions reliably across temperatures from -40°C to +85°C. Housed in a VQFN-56 package, this surface-mount device integrates graphics processing and touch control for efficient human-machine interface design.
Verify the specific suffix 'T' indicates tray packaging when ordering. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure supply chain partners provide valid certificates of conformity. Cross-reference the full part number against current Bridgetek datasheets to confirm pinout and electrical specifications match project requirements exactly.
Select this component for designs requiring integrated graphics and touch handling without external controllers. The VQFN-56 package suits space-constrained PCB layouts. Verify that the host microcontroller supports the required SPI speed and voltage levels. Consider thermal management capabilities given the operating temperature range and power consumption characteristics defined in the technical data sheet.
This part belongs to the FT81x series of video ICs by Bridgetek. It shares architectural similarities with other EVE family members but is distinguished by its specific touch interface type and packaging variant. The FT813Q-T represents a solution for mid-range graphical applications needing robust touch integration alongside standard RGB display driving capabilities.
The FT813Q-R serves as a reel-based alternative within the same functional family. Check if the change in packaging affects board assembly processes or inventory management strategies. Ensure electrical parameters remain identical before substituting to avoid redesign efforts.
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