G125-FV10605L0R

Overview

The G125-FV10605L0R is a 6-position female socket header from the Gecko-SL series by Harwin Inc. It features a 1.25 mm pitch and is designed for vertical through-hole termination with solder pins. The connector utilizes gold-plated beryllium copper contacts housed in green nylon insulation, rated for 2 A current and operating between -65°C and +150°C.

Feature Summary

• Vertical through-hole mounting configuration for board-to-board or cable applications
• Gold-plated beryllium copper contacts ensuring reliable signal transmission
• Green nylon housing providing UL 94 V-0 flammability rating

Applications

• Embedded systems requiring compact interconnects
• Industrial automation control modules
• General electronics circuit boards

Procurement Notes

Verify component authenticity against official Harwin documentation. Confirm that the specific suffix L0R corresponds to the reel packaging format intended for automated assembly processes. Ensure compatibility with mating male headers within the same Gecko-SL family to maintain proper alignment and electrical performance standards.

Selection Notes

Select this part for high-density layouts necessitating a 1.25 mm pitch. The vertical orientation suits space-constrained designs where board thickness must be minimized. Verify that the 2 A current rating and temperature range meet the specific operational requirements of the target electronic environment.

Part Context

This component belongs to the Gecko-SL series, characterized by micro-miniature dimensions and high reliability. It serves as a receptacle counterpart to male headers, facilitating secure connections in demanding environments. The series emphasizes robust mechanical locking and consistent electrical characteristics across various position counts.

Replacement Considerations

Direct substitutes include other 6-position Gecko-SL female sockets such as G125-FV10605M2R. Verify pin count, pitch, and termination style before substitution to ensure mechanical fit and electrical continuity without redesigning the PCB footprint.