G125-MS13405L0P

$13.06

Description：CONN HEADER SMD 34POS 1.25MM
Series：Gecko
Mfr：Harwin Inc.
Package：Bag

SKU:d5ad529888ac Category: Headers, Male Pins Brand: Harwin Inc.

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

Product Detailed Parameters

Description：CONN HEADER SMD 34POS 1.25MM
Series：Gecko
Mfr：Harwin Inc.
Package：Bag
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.049" (1.25mm)
Number of Positions：34
Number of Rows：2
Row Spacing - Mating：0.049" (1.25mm)
Number of Positions Loaded：All
Style：Board to Board or Cable
Shrouding：Shrouded - 4 Wall
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：-
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.193" (4.90mm)
Contact Shape：Circular
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：8.00µin (0.203µm)
Contact Finish - Post：-
Contact Material：Phosphor Bronze
Insulation Material：Polyamide (PA4T), Nylon 4T, Glass Filled, Halogen Free
Features：Pick and Place, Solder Retention
Operating Temperature：-65°C ~ 150°C
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Green
Current Rating (Amps)：2A per Contact
Voltage Rating：-

Download product information

G125-MS13405L0P

Overview

The G125-MS13405L0P is a Gecko-Latch series power-to-board connector manufactured by Harwin. It features a 1.25 mm pitch with 34 positions arranged in two rows. The component utilizes male pin contacts made of beryllium copper with gold plating, housed in a polyamide (PA4T) shell. Rated for 2 A current and 250 V/450 V voltage, it supports surface mount termination. The connector operates within a temperature range of -65°C to +150°C and includes solder retention capabilities.

Feature Summary

Vertical surface mount design optimized for pick-and-place assembly processes
Integrated solder retention mechanism ensures secure board attachment during reflow
High-temperature polyamide insulation material provides thermal stability

Applications

Power distribution in compact electronic modules
Server and storage backplane interconnects
Industrial control system power headers

Procurement Notes

Verify the specific suffix L0P against official datasheets to confirm tape and reel packaging requirements. Ensure compatibility with automated placement equipment specifications. Cross-reference RoHS compliance status directly with manufacturer documentation prior to procurement to meet regulatory standards.

Selection Notes

Select this component for applications requiring high-density vertical power connections with reliable solder joint integrity. The 1.25 mm pitch allows for compact layout designs while maintaining adequate spacing. Consider the operating temperature range and current rating when designing thermal management strategies for the target application environment.

Part Context

This part belongs to the Harwin Gecko-Latch family, designed for robust power delivery in space-constrained environments. The series emphasizes reliability through mechanical latching features and enhanced solder retention. It serves as a critical interface between power sources and circuit boards in modern electronics.