G125-MV13405M1P

G125-MV13405M1P

$16.56
  • Description:CONN HEADER VERT 34POS 1.25MM
  • Series:Gecko SL
  • Mfr:Harwin Inc.
  • Package:Strip

SKU:8fe51c377484 Category: Brand:

  
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Product Detailed Parameters

  • Description:CONN HEADER VERT 34POS 1.25MM
  • Series:Gecko SL
  • Mfr:Harwin Inc.
  • Package:Strip
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.049" (1.25mm)
  • Number of Positions:34
  • Number of Rows:2
  • Row Spacing - Mating:0.049" (1.25mm)
  • Number of Positions Loaded:All
  • Style:Board to Board or Cable
  • Shrouding:Shrouded - 4 Wall
  • Mounting Type:Through Hole
  • Termination:Solder
  • Fastening Type:Screw Lock
  • Contact Length - Mating:-
  • Contact Length - Post:0.118" (3.00mm)
  • Overall Contact Length:-
  • Insulation Height:0.193" (4.90mm)
  • Contact Shape:Circular
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:8.00µin (0.203µm)
  • Contact Finish - Post:Gold
  • Contact Material:Phosphor Bronze
  • Insulation Material:Polyamide (PA4T), Nylon 4T, Glass Filled, Halogen Free
  • Features:Mating Flange, Mounting Flange, Pick and Place
  • Operating Temperature:-65°C ~ 150°C
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Green
  • Current Rating (Amps):2A
  • Voltage Rating:450V

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G125-MV13405M1P

Overview

The Harwin G125-MV13405M1P is a Gecko-SL series power-to-board header featuring a 1.25 mm pitch and 34 contacts arranged in two rows. It utilizes male pin contacts with gold plating on beryllium copper, rated for 2 A current. The connector employs a vertical through-hole solder termination with reverse fix tape packaging for pick-and-place assembly. Operating temperatures range from -65°C to +150°C, with a nylon housing.

Feature Summary

  • Vertical wire-to-board configuration designed for automated pick-and-place manufacturing processes
  • Reverse fix tape packaging ensures correct orientation during surface mount assembly
  • Gold-plated beryllium copper contacts provide reliable electrical performance in power applications

Applications

  • Power distribution within electronic equipment boards
  • Automated SMT assembly lines requiring precise component orientation
  • High-density interconnect solutions in industrial electronics

Procurement Notes

Verify the specific suffix 'P' confirms the reverse fix tape packaging variant compatible with automated placement equipment. Confirm that the beryllium copper contact material meets environmental compliance requirements for the target application. Ensure the vertical height specifications align with the mechanical constraints of the receiving board assembly.

Selection Notes

Select this part when high-density power connections are required alongside automated assembly capabilities. The Gecko-SL series offers robust mechanical retention suitable for demanding environments. Consider the 1.25 mm pitch density against available board space constraints. Verify thermal management needs given the 150°C maximum operating temperature rating.

Part Context

This component belongs to Harwin's Gecko-SL family, engineered for compact power-to-board interconnections. The series emphasizes reliability in harsh conditions while supporting modern surface mount technology workflows. The design integrates secure mating features with standardized dimensions for consistent performance across various industrial and commercial electronic systems.

Replacement Considerations

Cross-reference with other Gecko-SL variants sharing identical pitch and row configurations. Verify mechanical footprint compatibility before substituting with alternative manufacturers' connectors offering similar 1.25 mm spacing.

G125-MV13405M1PG125-MV13405M1P
$16.56
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