G125-MV15005M3P

Overview

The Harwin G125-MV15005M3P is a Gecko-SL series power-to-board connector designed for vertical surface-mount installation. It features a dual-row configuration with 50 positions and a 1.25 mm pitch. The component utilizes gold-plated phosphor bronze contacts housed in polyamide insulation, rated for 2 A current and up to 450 V voltage. Operating temperatures range from -65 °C to +150 °C, with an insulation resistance of 10 GOhms.

Feature Summary

• Vertical SMT header design for space-constrained stacking applications
• Gold-plated phosphor bronze contacts for reliable conductivity
• Polyamide housing supporting high-temperature environments

Applications

• Server and storage backplane interconnects
• High-density PCB stacking modules
• Industrial control system power distribution

Procurement Notes

Verify the specific suffix 'M3P' against the manufacturer's latest datasheet to confirm contact plating thickness and termination style compatibility. Ensure the ordering quantity aligns with the factory packaging requirements specified by Harwin Inc. for this particular variant.

Selection Notes

Select this component when a vertical, low-profile interconnect solution is required for high-density power routing. The 1.25 mm pitch allows for significant pin counts within a compact footprint, while the SMT mounting facilitates automated assembly processes.

Part Context

This part belongs to the Gecko-SL family, which provides secure mating solutions for demanding electronic environments. The series is engineered for robust performance in applications requiring reliable electrical connections under mechanical stress or thermal cycling conditions.

Replacement Considerations

No public confirmed substitute part numbers are available for this specific model.