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G630H9812248EU is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN PCI EXP FMALE 98POS 0.039. Review the specifications below when checking this part for your BOM.
The G630H9812248EU is a PCI Express card edge connector manufactured by Amphenol ICC (FCI). It features 98 positions with a 0.039 inch (1.00mm) pitch. The component utilizes surface mount termination and is designed for straddle mount installation on the board edge. Contact surfaces are finished with gold plating to ensure reliable signal transmission. The housing is constructed from black thermoplastic material, providing structural integrity and insulation for high-density interconnect applications in electronic systems.
Verify the specific suffix codes against official manufacturer documentation to confirm exact mechanical dimensions and contact finish specifications. Ensure compatibility with mating card edge thicknesses and PCB stack-up requirements before finalizing procurement orders to prevent assembly mismatches.
Select this component when a low-profile, high-density connection is required for PCI Express generation 3.0 or later applications. Consider the straddle mount style for improved mechanical stability compared to standard edge mount options. Evaluate thermal management needs as the compact form factor may influence heat dissipation strategies within the enclosure.
This part belongs to the PCIe Gen3 V/T Straddle Mount series, designed for next-generation high-speed data transfer. It complements other Amphenol FCI connectors by offering a robust solution for dense I/O configurations. The series supports evolving bandwidth demands while maintaining backward compatibility with earlier PCI Express standards in enterprise environments.
Consult official cross-reference guides for direct substitutes. Verify that alternative parts match the 98-position count, 1.00mm pitch, and straddle mount footprint to ensure mechanical and electrical interchangeability without redesigning the host PCB layout.
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