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The GBLA08-E3/45 is a glass-passivated single-phase bridge rectifier manufactured by Vishay General Semiconductor - Diodes Division. It features an in-line circuit configuration within a GBL package, rated for a maximum repetitive peak reverse voltage of 800 V and a maximum average forward rectified output current of 4.0 A at a case temperature of 50 °C. The device exhibits a typical instantaneous forward voltage drop of 1.0 V at 4.0 A and a maximum DC reverse current of 5 μA at rated blocking voltage. It supports a peak forward surge current of 120 A and operates within a junction and storage temperature range of -55 °C to +150 °C.
This component has reached End of Life status according to the official datasheet revision dated 15-Aug-2023. Verification of availability through authorized distributors is required as standard stock may be depleted. Procurement planning should account for the discontinued status and potential lead time variations from remaining inventory sources.
Designers must verify that the 800 V reverse voltage rating aligns with the specific AC input line conditions. The 4.0 A current rating assumes a case temperature of 50 °C; derating curves provided in the datasheet are necessary for accurate thermal management at higher ambient temperatures or different mounting configurations.
The GBLA08 belongs to the GBLAxx series of glass-passivated single-phase bridge rectifiers. This series includes variants with reverse voltage ratings ranging from 50 V to 1000 V, all sharing the same GBL package and 4.0 A current handling capability. The E3 suffix indicates RoHS compliance and halogen-free construction.
Officially recommended alternative devices include the GBL08E series (GBL08E-E3/P). These replacements maintain similar electrical characteristics and package dimensions while offering updated manufacturing specifications.
The GBLA08 supports a peak forward surge current of 120 A for a single sine-wave superimposed on rated load.
It offers an extended operating junction and storage temperature range of -55 °C to +150 °C, exceeding typical commercial limits.
When mounted on a PCB with specified copper pads and lead length, the typical junction-to-ambient thermal resistance is 47 °C/W.