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The onsemi GBPC12005W is a single-phase glass-passivated bridge rectifier from the GBPC 12 series, housed in a GBPC-W package with wire leads. It features an average rectified forward current (IF(AV)) of 12 A at a case temperature of 55°C and a maximum repetitive reverse voltage (VRRM) of 50 V. The device supports a non-repetitive peak forward surge current (IFSM) of 300 A for an 8.3 ms half-sine wave. Electrical characteristics include a maximum forward voltage drop (VF) of 1.1 V at 6.0 A and a maximum reverse current (IR) of 5.0 µA at 25°C. Thermal resistance from junction to case is 1.5°C/W, with power dissipation rated at 83.3 W.
Verify the specific ordering suffix 'W' confirms the wire lead structure as distinct from standard pin configurations. Confirm Pb-free status and UL certification file E258596 compliance during sourcing. Check for discontinued status notifications if availability is critical, as some variants in the series may be phased out. Ensure mounting torque does not exceed 20 in-lbs to prevent mechanical damage.
Select this component when a 12 A average current rating and 50 V reverse voltage are required for single-phase applications. The GBPC-W package is appropriate for designs utilizing wire termination rather than through-hole pins. Consider the 300 A surge capability for inrush current handling. Verify thermal management requirements against the 1.5°C/W junction-to-case resistance for proper heatsinking.
This part belongs to the onsemi GBPC 12, 15, 25, and 35 series of bridge rectifiers. The GBPC12005W specifically denotes the 12 A current class within the 50 V reverse voltage lineup. The 'W' suffix differentiates it by its wire lead construction, while maintaining the same electrical performance and thermal characteristics as other packages in the series.
Compatible substitutes include the GBPC12005 (pin type) for identical electrical performance with different termination. Other manufacturers offering glass-passivated bridge rectifiers with 12 A IF(AV) and 50 V VRRM ratings may serve as alternatives, provided thermal and mechanical constraints are met.