GBPC2502M

Overview

The GBPC2502M is a single-phase standard bridge rectifier manufactured by Taiwan Semiconductor Corporation. It features an integrally molded heatsink and glass passivated chip junctions within the GBPC-M package. The device supports a repetitive peak reverse voltage (VRRM) of 200 V and a forward current (IF) of 25 A. Key electrical specifications include a typical forward voltage (VF) of 1.1 V at 12.5 A, a maximum non-repetitive peak forward surge current (IFSM) of 300 A, and a typical reverse leakage current (IR) of 5 µA. The component operates within a junction temperature range of -55°C to +150°C.

Feature Summary

• Integrally molded heatsink design for efficient thermal dissipation
• Glass passivated chip junctions for enhanced reliability
• High surge current capability with robust fusing ratings

Applications

• Switching mode power supplies (SMPS)
• AC to DC converter circuits

Procurement Notes

Verify the specific ordering code against the manufacturer's datasheet to ensure correct package configuration. Confirm that the GBPC-M variant matches the required terminal orientation and mounting torque specifications for the target assembly process.

Selection Notes

Select this component based on the 200 V reverse voltage rating and 25 A continuous forward current requirements. Ensure the application accounts for the 1.5 °C/W junction-to-case thermal resistance and derating curves when determining heat sink sizing for optimal performance.

Part Context

This part belongs to the GBPC15, 25, and 35 series of standard bridge rectifiers from Taiwan Semiconductor. The series offers various voltage ratings from 50 V to 1000 V and includes different package options such as GBPC, GBPC-W, and GBPC-M to accommodate diverse mechanical mounting needs.

Replacement Considerations

Cross-reference with other GBPC2502 variants from different manufacturers. Verify that substitute components match the 25 A current rating, 200 V blocking voltage, and GBPC-M physical dimensions.