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The GeneSiC Semiconductor GBPC2502T is a single-phase glass-passivated silicon bridge rectifier designed for high-power applications. It features an integrally molded heat sink within the GBPC-T package to ensure efficient thermal dissipation. The device supports a maximum average forward rectified current of 25.0 A and withstands a repetitive peak reverse voltage of 200 V. Key electrical characteristics include a peak forward surge current capability of 300 A, a typical junction-to-case thermal resistance of 1.9 °C/W, and a maximum instantaneous forward voltage drop of 1.1 V per leg. It operates reliably across a temperature range from -55 °C to +150 °C.
Verify the specific package variant required, as the datasheet distinguishes between GBPC-T (through-hole leads) and GBPC-W variants. Confirm terminal type availability, which may include nickel-plated faston lugs or copper leads. Ensure compliance with RoHS standards if applicable to the project requirements before finalizing procurement orders.
Select this component when a 25 A continuous current rating and 200 V blocking voltage are required. The GBPC-T package is suitable for bolt-down mounting on heat sinks using silicone thermal compound. Consider the 1.9 °C/W thermal resistance for heatsink sizing calculations. Derate current by 20% if used with capacitive loads to prevent overstress.
This part belongs to the GBPC25 series of single-phase bridge rectifiers. It shares the same physical footprint and thermal management design with other ratings in the family, such as the GBPC25005T and GBPC2504T, differing primarily in voltage ratings. The GBPC-T suffix indicates the standard through-hole lead configuration.
Direct replacements must match the 25 A current rating, 200 V voltage rating, and GBPC-T package dimensions. Verify that substitute components offer equivalent thermal resistance and surge current capabilities to maintain system reliability.