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The GeneSiC Semiconductor GBPC2504T is a single-phase glass-passivated silicon bridge rectifier designed for high-reliability power conversion applications. It features an integrally molded heatsink within the GBPC-T package to facilitate efficient thermal dissipation. The device supports a maximum average forward rectified current of 25 A and withstands a repetitive peak reverse voltage of 400 V. It exhibits a peak forward surge current capability of 300 A under standard half-sine wave conditions. The component operates reliably across a wide temperature range, with junction and storage temperatures spanning from -55 °C to +150 °C.
Verify that the specific ordering suffix corresponds to the GBPC-T package variant rather than the W variant, as terminal configurations differ between faston lugs and copper leads. Confirm compliance requirements such as RoHS status directly with the manufacturer documentation before finalizing procurement orders.
Select this component when a 25 A continuous current rating and 400 V blocking voltage are required in a compact flange-mountable form factor. Ensure the application environment does not exceed the 150 °C maximum junction temperature limit. Consider the 300 A surge rating for systems with significant inrush currents during startup phases.
This part belongs to the GBPC25 series of single-phase bridge rectifiers manufactured by GeneSiC Semiconductor. The series includes variants with different voltage ratings ranging from 50 V to 1000 V, all sharing the same 25 A current capacity and mechanical footprint. The GBPC2504T specifically addresses mid-range voltage applications requiring robust surge handling capabilities.
Direct substitutes include the GBPC2504W which utilizes the GBPC-W package with different terminal styles. Other manufacturers offering equivalent 25 A / 400 V GBPC-style rectifiers may require verification of thermal resistance and mounting torque specifications to ensure mechanical compatibility.