GBPC2508W-G

Overview

The GBPC2508W-G is a single-phase bridge rectifier manufactured by Comchip Technology, designed for general-purpose power conversion applications. It features an average forward rectified current of 25 A and a maximum repetitive peak reverse voltage of 800 V. The device utilizes glass passivated die construction to ensure low reverse leakage current and high reliability under varying thermal conditions. Electrical characteristics include a maximum non-repetitive peak forward surge current of 400 A at 60 Hz and a maximum DC blocking current of 10 µA at 800 V. The component operates within a junction temperature range of -55 °C to +150 °C and exhibits a maximum forward voltage drop of 1.1 V at the rated current.

Feature Summary

• Glass passivated die construction provides robust protection against mechanical stress and environmental corrosion.
• Electrically isolated epoxy case with an internally mounted metal heat sink facilitates efficient thermal dissipation.
• Low reverse leakage current minimizes power loss and enhances overall system efficiency.
• Terminals are solderable per MIL-STD-202 standards, ensuring secure mounting on printed circuit boards.

Applications

• General purpose AC to DC power supply circuits
• Battery charging systems requiring high surge current handling
• Industrial power supplies and motor control units

Procurement Notes

Verify the specific ordering suffix to confirm compliance with RoHS directives and lead-free manufacturing requirements. Ensure that the procurement documentation explicitly references the GBPC2508W-G part number to distinguish it from standard variants without the W designation. Confirm that the supplier provides traceability data consistent with the manufacturer's quality standards for automotive or industrial grade components.

Selection Notes

Select this component when designing circuits that require a 25 A continuous current rating with an 800 V reverse voltage capability. The integrated heatsink design makes it suitable for applications where board space is limited but thermal management is critical. Verify that the operating environment does not exceed the specified junction temperature limits and that the PCB layout supports the required terminal spacing for the GBPC-W package.

Part Context

This component belongs to the GBPC series of single-phase bridge rectifiers produced by Comchip Technology. The series is characterized by its use of glass passivation technology to enhance durability compared to standard plastic encapsulated diodes. The GBPC2508W-G specifically addresses the need for higher current density in compact form factors, serving as a reliable alternative to discrete diode configurations in medium-power electronics.

Replacement Considerations

Compatible substitutes include the GBPC2508W from Taiwan Semiconductor and the VS-GBPC2508W from Vishay Intertechnologies. These alternatives share identical electrical ratings and pin configurations, allowing for direct replacement in existing designs without modifying the printed circuit board footprint.