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The GeneSiC Semiconductor GBPC3504T is a single-phase glass-passivated silicon bridge rectifier rated for a repetitive peak reverse voltage of 400 V and a maximum average forward rectified current of 35 A. It features a peak forward surge current capability of 400 A and a typical junction capacitance of 300 pF. The device operates within a temperature range of -55°C to +150°C, with a maximum instantaneous forward voltage drop of 1.1 V per leg. It utilizes the GBPC-T package, which includes an integrally molded heat sink for efficient thermal dissipation.
Verify the specific manufacturer designation as sources may list GeneSiC Semiconductor or Navitas Semiconductor for this part number. Confirm the package variant matches the required terminal configuration, as the datasheet distinguishes between GBPC-T (solder pin) and GBPC-W (screw mount) styles. Ensure the component meets the necessary thermal management requirements given its 35 A rating and integrated heat sink design.
Select this component when a 400 V reverse voltage rating and 35 A continuous current are required in a compact bridge rectifier form factor. The GBPC-T package is suitable for applications where through-hole soldering is preferred over screw mounting. Consider the 1.4 °C/W thermal resistance and the need for silicone thermal compound if using bolt-down mounting configurations for optimal performance.
This component belongs to the GBPC35005T/W through GBPC3504T/W series, covering voltage ratings from 50 V to 400 V. All variants share identical current ratings and thermal characteristics, differing only in their peak reverse voltage specifications. The GBPC3504T represents the highest voltage option in this specific standard package lineup.
Direct replacements include the GBPC3504W for screw-mount applications, though terminal types differ. Other manufacturers offering equivalent 35 A / 400 V GBPC packages should be evaluated for matching thermal resistance and terminal compatibility.