GBPC4010

Overview

The GBPC4010 is a single-phase bridge rectifier manufactured by Taiwan Semiconductor Corporation. It features a maximum average forward rectified current of 40 A and a peak repetitive reverse voltage of 1000 V. The device supports a maximum surge current of 400 A and has a typical forward voltage drop of 1.1 V at rated current. Reverse leakage current is specified at 10 uA. Operating temperature ranges from -50 C to +150 C junction temperature. Physical dimensions are 29 mm x 29 mm x 7.87 mm in a GBPC-M package for through-hole mounting.

Feature Summary

• High thermal stability with extended operating temperature range up to 150 C
• Robust surge current handling capability of 400 A
• Low forward voltage drop for improved efficiency
• Through-hole mounting design for secure PCB integration

Applications

• AC-DC power supply circuits
• Battery chargers
• Inverter circuits
• General-purpose rectification

Procurement Notes

Verify the manufacturer part number matches Taiwan Semiconductor Corporation exactly. Confirm RoHS compliance status if required by project specifications. Check datasheet revisions for any updates to electrical characteristics or mechanical drawings before finalizing procurement orders.

Selection Notes

Select this component when 40 A continuous current and 1000 V blocking voltage are required. Ensure the PCB layout accommodates the 29 mm x 29 mm footprint. Consider thermal management solutions given the 150 C maximum junction temperature rating and 1.1 V forward voltage drop under load conditions.

Part Context

This component belongs to the GBPC series of bridge rectifiers from Taiwan Semiconductor. The series offers various voltage ratings while maintaining consistent current handling and physical dimensions. The GBPC4010 specifically targets high-voltage applications within this standardized form factor family.

Replacement Considerations

Cross-reference with other manufacturers offering GBPC40xx series parts. Verify identical pinout, current ratings, and voltage ratings before substitution. Ensure thermal performance characteristics match original design requirements.