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The GeneSiC Semiconductor GBPC5002T is a single-phase glass-passivated silicon bridge rectifier designed for high-current applications. It features an average forward rectified current (IO) of 50.0 A and a repetitive peak reverse voltage (VRRM) of 200 V. The device supports a peak forward surge current (IFSM) of 400 A under single sine-wave conditions. Electrical characteristics include a maximum instantaneous forward voltage drop (VF) of 1.2 V per leg at 25 A and a typical junction capacitance (Cj) of 360 pF. Thermal performance is defined by a typical thermal resistance (RΘJC) of 1.2 °C/W. The component operates within a junction temperature range of -55 to 150 °C and provides 2500 V RMS isolation from the case to the leads.
Verify the specific suffix 'T' against the manufacturer's documentation to confirm terminal configuration, as datasheets indicate variations between faston lugs and copper leads. Confirm RoHS compliance status and lead-free material declarations prior to ordering. Ensure the supplier provides the official datasheet for the exact part number variant to validate electrical ratings and mechanical dimensions.
Select this component when a 50 A continuous current rating and 200 V blocking voltage are required. The GBPC-T package is suitable for bolt-down mounting on heat sinks using silicone thermal compound. Consider the 1.2 °C/W thermal resistance for heatsink sizing calculations. Derate the forward current by 20% if the application involves capacitive loads rather than standard resistive or inductive configurations.
The GBPC5002T belongs to the GBPC series of single-phase glass-passivated silicon bridge rectifiers. This series covers voltage ratings from 50 V to 400 V while maintaining a consistent 50 A current capacity. The 'T' designation typically refers to the specific terminal style or package variant within the GBPC family, distinguishing it from other mounting configurations available in the same product line.
Compatible substitutes must match the 50 A current rating, 200 V reverse voltage, and GBPC-T package form factor. Verify that alternative components offer equivalent thermal resistance and surge current capabilities. Ensure terminal compatibility, specifically checking for matching faston lug or lead dimensions if direct pin-to-pin replacement is intended.