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The GBU15G is a single-phase glass-passivated silicon bridge rectifier manufactured by GeneSiC Semiconductor. It features a maximum repetitive peak reverse voltage of 400 V and an average rectified forward current of 15 A at a case temperature of 100 °C. The device exhibits a maximum forward voltage drop of 1.05 V at 7.5 A and supports a peak forward surge current of 500 A under specified conditions. Thermal resistance from junction to ambient is 22 °C/W when mounted on a PCB without a heatsink, while the junction-to-case thermal resistance is 5.0 °C/W. The component operates within a temperature range of -40 °C to +150 °C.
Verify the manufacturer designation carefully, as GeneSiC Semiconductor products may be listed under Navitas Semiconductor due to corporate acquisition. Confirm the specific electrical ratings against the official datasheet before procurement. Ensure compliance with RoHS directives if required by the application. Check for updated documentation regarding product discontinuation or lifecycle status.
Select this component for applications requiring a 400 V reverse voltage rating and 15 A continuous current capacity. Consider the thermal resistance values when designing heat dissipation strategies. Ensure the operating environment stays within the specified -40 °C to +150 °C junction temperature range. Verify that the package dimensions fit the intended PCB layout constraints.
The GBU15G belongs to the GBU series of single-phase bridge rectifiers, which includes variants with different voltage ratings such as GBU15A through GBU15M. This series shares common mechanical characteristics, including the GBU package style and epoxy resin construction. The 'G' suffix specifically denotes the 400 V repetitive peak reverse voltage rating within this family.
Direct replacements must match the 15 A current rating and 400 V reverse voltage specification. Components from other manufacturers using the GBU package can serve as substitutes if electrical parameters are equivalent. Verify pinout compatibility and thermal performance characteristics before implementation.