GBU2505 D2

Overview

The Taiwan Semiconductor GBU2505 D2 is a single-phase bridge rectifier in the GBU package, rated for 25 A average forward current and 600 V repetitive peak reverse voltage. It features a maximum surge current capability of 300 A and operates within a junction temperature range of -55 °C to +150 °C. The device exhibits a typical forward voltage of 1.08 V at 25 A and 25 °C, with a maximum reverse leakage current of 10 µA at rated voltage. Thermal resistance from junction to ambient is typically 22 °C/W.

Feature Summary

• Glass passivation for reliable operation under harsh conditions
• Molding compound meets UL 94V-0 flammability rating
• Matte tin plated leads solderable per J-STD-002

Applications

• Switching mode power supplies (SMPS)
• Adapters
• Lighting applications

Procurement Notes

Verify the specific ordering code against the manufacturer's official documentation to ensure correct voltage ratings and packaging options. Confirm RoHS compliance and halogen-free status requirements prior to procurement. Check for any recent updates to the datasheet version or mechanical dimensions that may affect board layout compatibility.

Selection Notes

Select this component when a 600 V blocking voltage and 25 A continuous current are required in a through-hole GBU package. Ensure the application does not exceed the 300 A surge current limit during startup or fault conditions. Verify thermal management strategies align with the specified junction-to-ambient thermal resistance values for the intended operating environment.

Part Context

This part belongs to the GBU2504–GBU2507 series of standard bridge rectifiers manufactured by Taiwan Semiconductor. The series offers various voltage ratings from 400 V to 1000 V while maintaining a consistent 25 A current capacity and GBU footprint. This allows designers to standardize on a single package type across different voltage requirements within a product line.

Replacement Considerations

Direct replacements must match the 25 A current rating, 600 V reverse voltage, and GBU package outline. Verify that alternative components meet the same thermal resistance and forward voltage specifications to maintain circuit performance without redesign.