SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The GBU6A-M3/45 is a single-phase inline bridge rectifier manufactured by Vishay Semiconductors. It utilizes Glass Passivated Chip technology (GPP) to provide reliable reverse blocking capabilities. The device is rated for a maximum average forward rectified current of 6 Amperes and a repetitive peak reverse voltage of 600 Volts. It features an AEC-Q101 qualified variant suitable for automotive applications. The component is housed in a robust GBU package designed for through-hole mounting on printed circuit boards, offering efficient thermal dissipation for industrial power supply environments.
Verify the specific suffix configuration against the manufacturer's official datasheet to confirm lead-free status and packaging type. Confirm that the GBU package dimensions match the target PCB footprint. Check for RoHS compliance declarations if environmental regulations apply to the final assembly. Ensure the 600V rating meets the peak inverse voltage requirements of the AC input stage.
Select this component when a 6A continuous current rating and 600V reverse voltage are required for single-phase rectification. The GBU package is appropriate for applications needing higher current handling than smaller bridge rectifiers. Consider the thermal resistance characteristics of the GBU housing for heatsinking requirements. Verify that the forward voltage specifications align with the system's efficiency targets.
This part belongs to Vishay's GBU series of glass passivated bridge rectifiers. The series offers various current and voltage combinations within the same mechanical footprint. The M3 suffix typically indicates halogen-free and RoHS-compliant construction. The /45 suffix denotes tube packaging. This series is widely used in standard industrial and commercial power conversion designs.
Direct replacements include other GBU6A variants from different manufacturers with identical pinouts and ratings. Ensure substitute parts maintain the same GPP technology for comparable reverse leakage characteristics. Verify that alternative packages fit the existing PCB layout without modification.