GBU6B

Overview

The onsemi GBU6B is a single-phase rectifier bridge rated for an 800 V repetitive peak reverse voltage (Vrrm) and a continuous forward current of 6 A. It utilizes the GBU surface-mount package with four pins, designed for through-hole mounting on printed circuit boards. The device supports a maximum operating temperature of 150°C and a minimum of -55°C. Key electrical characteristics include a peak non-repetitive forward surge current (Ifsm) of 175 A and a typical peak forward voltage drop of 1 V at rated current. The component features low leakage current and robust thermal performance suitable for general-purpose power supply applications.

Feature Summary

• High-voltage capability with 800 V reverse blocking rating
• Compact GBU surface-mount footprint for automated assembly
• Robust surge current handling up to 175 A
• Wide operating temperature range from -55°C to 150°C

Applications

• General-purpose AC-DC power supplies
• Battery chargers
• Adapters and converters

Procurement Notes

Verify the specific part number suffix against official onsemi documentation to confirm exact electrical tolerances and packaging details. Ensure compliance with RoHS directives if required by the target application. Cross-reference the manufacturer's datasheet for precise thermal resistance values and recommended soldering profiles to guarantee reliability during assembly.

Selection Notes

Select the GBU6B when an 800 V reverse voltage rating is necessary for mains-connected or high-voltage DC link applications. The 6 A continuous current rating makes it suitable for moderate power levels where space constraints favor a surface-mount bridge over axial-leaded alternatives. Consider the GBU package dimensions for PCB layout compatibility and verify that the 150°C junction temperature limit aligns with the system's thermal management strategy.

Part Context

The GBU6B belongs to the GBU series of single-phase rectifier bridges manufactured by onsemi. This series is characterized by its glass-passed chip junctions and plastic encapsulation using epoxy mold compounds. The GBU package provides a compact solution compared to traditional through-hole designs, facilitating higher density PCB layouts while maintaining reliable performance in standard industrial and consumer electronics environments.

Replacement Considerations

Direct replacements must match the 800 V Vrrm, 6 A If, and GBU package outline. Verify pinout compatibility and thermal characteristics before substitution.