GD25B128ESIGR

$1.45

Description：IC FLASH 128MBIT SPI/QUAD 8SOP
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:9eb54ac96d27 Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25B128ESIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25B128ESIGR

Description：IC FLASH 128MBIT SPI/QUAD 8SOP
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR),Cut Tape (CT)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR (SLC)
Memory Size：128Mbit
Memory Organization：16M x 8
Memory Interface：SPI - Quad I/O
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：70µs, 2.4ms
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：8-SOIC (0.209", 5.30mm Width)
Supplier Device Package：8-SOP
Access Time：7 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25B128ESIGR

GD25B128ESIGR

Memory IC Overview

The GD25B128ESIGR is a non-volatile NOR flash memory IC manufactured by GigaDevice. It features a storage capacity of 128 Mbit organized as 16M x 8 bits. The device utilizes a Quad I/O SPI interface with a maximum clock frequency of 133 MHz and an access time of 7 ns. It operates within a supply voltage range of 2.7 V to 3.6 V and supports an industrial temperature range from -40°C to +85°C. The component is housed in an 8-SOP surface-mount package.

Memory IC Feature Summary

Supports high-speed Quad I/O SPI communication for efficient data transfer
Provides non-volatile code storage using SLC NAND technology
Designed for industrial operating temperatures to ensure reliability

Memory IC Applications

Consumer electronics firmware storage
Industrial control system code execution
Embedded application data retention

Memory IC Procurement Notes

Verify the specific suffix 'GR' against the manufacturer's official datasheet to confirm the exact tape-and-reel packaging configuration and moisture sensitivity level. Ensure that the 2.7V to 3.6V supply voltage requirements align with the target system design before procurement. Confirm RoHS3 compliance status through the latest environmental declaration documents provided by the manufacturer.

Memory IC Selection Notes

Select this component when a 128 Mbit density is required for applications needing 133 MHz Quad SPI performance. It is suitable for designs requiring operation between 2.7 V and 3.6 V. Consider the 8-SOP package constraints for PCB layout. Verify compatibility with existing controller interfaces supporting standard SPI protocols.

Memory IC Part Context

This part belongs to the GD25B128E series of SPI NOR flash memories. The series is designed for general-purpose code storage applications. It shares common interface specifications with other devices in the family but differs in specific package options and manufacturing revisions. The 'GD25B128' base number indicates the core memory architecture and density.