Memory IC GD25B16ES2GR product image

GD25B16ES2GR

$0.58
  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:207be4e0f845 Category: Brand:

  
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GD25B16ES2GR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25B16ES2GR

  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25B16ES2GR

GD25B16ES2GR

Memory IC Overview

The GD25B16ES2GR is a NOR flash memory component manufactured by GigaDevice, belonging to the GD25B16E series. It provides a storage capacity of 16 Mbit with an organization of 2M x 8. The device supports Dual/Quad SPI and QPI interfaces, operating at a maximum clock frequency of 133 MHz. It functions within a supply voltage range of 2.7 V to 3.6 V and maintains an active read current of up to 25 mA. The operational temperature range spans from -40°C to +85°C. The component is available in SOP-8 packaging and is supplied in Reel or Cut Tape formats.

Memory IC Feature Summary

  • Supports Dual/Quad SPI and QPI interface modes for flexible data transfer
  • Provides high-speed synchronous operation with a maximum clock frequency of 133 MHz
  • Includes hardware reset and write protect capabilities for system reliability

Memory IC Applications

  • Code storage in embedded systems requiring fast random access
  • XIP (Execute-In-Place) applications for direct code execution
  • Firmware storage in consumer electronics and industrial controllers

Memory IC Procurement Notes

Verify the specific suffix 'S2GR' against the manufacturer's official datasheet to confirm package type and tape/reel specifications. Ensure the ordering quantity aligns with the factory pack size of 2000 units if purchasing in reels. Confirm RoHS compliance status through the provided certification documents before finalizing procurement.

Memory IC Selection Notes

Select this part when a 16 Mbit density is required with support for Quad SPI and QPI protocols. It is suitable for designs needing a 2.7 V to 3.6 V supply range and standard commercial temperature operation. Consider the SOP-8 package dimensions for PCB layout constraints and verify compatibility with existing controller SPI pins.

Memory IC Part Context

This component is part of the GD25B16E family of SPI NOR flash memories. It shares architectural similarities with other devices in the series but differs in specific package options and interface configurations. The GD25B16ES2GR specifically utilizes the SOP-8 form factor, distinguishing it from WSON or TFBGA variants within the same memory density class.

Memory IC Replacement Considerations

GD25Q16ESIGR: Similar 16 Mbit density and SOP-8 package, though interface support may vary.

Memory IC FAQ

What is the maximum clock frequency supported by the GD25B16ES2GR?

The device supports a maximum clock frequency of 133 MHz in Quad SPI and QPI modes.

Does the GD25B16ES2GR support Execute-In-Place (XIP)?

Yes, as a NOR flash memory, it supports XIP for direct code execution from the chip.

GD25B16ES2GRGD25B16ES2GR
$0.58
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