GD25B256EYIGR

Memory IC Overview

The GD25B256EYIGR is a 256M-bit (32M x 8) NOR flash memory manufactured by GigaDevice. It supports standard, dual, and quad SPI interfaces with a maximum clock frequency of 133 MHz. The device operates within a voltage range of 2.7 V to 3.6 V and features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. It includes advanced security features such as hardware write protection and OTP locks.

Memory IC Feature Summary

• Supports Dual and Quad SPI modes for high-speed data transfer up to 532 Mbits/s
• Features flexible architecture with uniform 4K-byte sectors and 32/64K-byte blocks
• Includes advanced security mechanisms like software write protection and one-time programmable lock bits
• Enables Execute In Place (XiP) operation with continuous read wrap capabilities

Memory IC Applications

• Code storage in embedded systems requiring fast boot times
• Firmware storage for IoT devices and consumer electronics
• Data logging applications needing reliable non-volatile storage
• Industrial control systems requiring robust data retention

Memory IC Procurement Notes

Verify the specific package variant (WSON-8, SOP-16, or TFBGA-24) matches your PCB footprint requirements. Confirm that the operating voltage range of 2.7V to 3.6V aligns with your system power supply design. Ensure compatibility with standard SPI controllers supporting dual and quad I/O modes for optimal performance.

Memory IC Selection Notes

Select this component when high-density code storage is required alongside fast read speeds. Consider the WSON-8 package for space-constrained designs. Evaluate the need for extended address mode if accessing memory regions beyond 128Mb in 3-byte addressing configurations. Check thermal requirements against the specified industrial temperature range.

Memory IC Part Context

This part belongs to the GD25B series of serial flash memories from GigaDevice. It is designed for applications demanding high reliability and performance. The series supports various package options including WSON, SOP, and TFBGA to accommodate different board layout constraints and thermal management needs.

Memory IC Replacement Considerations

GD25Q256EYIGR: Similar capacity but may differ in specific electrical characteristics or feature sets; verify datasheet details before substitution.