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GD25B32EEAGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25B32EEAGR
- Description：IC FLASH 32MBIT SPI/QUAD 8USON
- Series：GD25B
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：32Mbit
- Memory Organization：4M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-XFDFN Exposed Pad
- Supplier Device Package：8-USON (3x2)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25B32EEAGR
Memory IC Overview
The GD25B32EEAGR is a 32 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 3.6 V and supports maximum clock frequencies up to 166 MHz. The component utilizes an 8-pin USON package and is designed for industrial temperature ranges spanning from -40°C to +125°C. This non-volatile memory solution provides reliable data storage with high-speed serial interface capabilities suitable for embedded systems.
Memory IC Feature Summary
- Supports wide voltage operation from 1.65 V to 3.6 V for flexible system integration
- Delivers high-speed data transfer with maximum clock frequency of 166 MHz
- Engineered for extended reliability in industrial environments with wide temperature tolerance
Memory IC Applications
- Industrial control systems requiring robust environmental performance
- Embedded devices operating under variable power supply conditions
- Consumer electronics demanding compact form factors and low power consumption
Memory IC Procurement Notes
Verify the specific suffix EEAGR against official GigaDevice documentation to confirm package type, temperature grade, and tape-and-reel specifications. Ensure compatibility with your board's footprint and thermal requirements before finalizing procurement decisions.
Memory IC Selection Notes
Select this component when a wide voltage input range and industrial-grade temperature stability are required. The USON-8 package offers space efficiency compared to standard SOP packages. Confirm that the 166 MHz speed meets your system's timing constraints.
Memory IC Part Context
This part belongs to the GD25B series of SPI NOR flash memories. It shares architectural similarities with other members like the GD25B32ESIGR but differs in package style and potentially operational characteristics. The GD25LE series also offers similar low-power features but may vary in specific electrical parameters.
Memory IC Replacement Considerations
GD25B32ESIGR: Similar capacity and speed but uses SOP-8 package. Verify pinout compatibility and thermal performance differences between USON-8 and SOP-8 packages before substitution.
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