GD25B32ENAGR

Memory IC Overview

The GD25B32ENAGR is a 32Mbit NOR flash memory IC manufactured by GigaDevice Semiconductor (HK) Limited. It utilizes SPI Quad I/O interface for data transfer and operates within a voltage range of 2.7V to 3.6V. The device supports clock frequencies up to 133MHz and functions reliably across an industrial temperature range of -40°C to +85°C. It is housed in an 8-USON (3x4) package, designed for surface-mount technology applications requiring compact non-volatile storage solutions.

Memory IC Feature Summary

• Provides 32Mbit non-volatile data storage capacity using SLC NAND technology
• Supports high-speed SPI Quad I/O interface for efficient data access
• Operates within standard 3.3V power supply specifications
• Engineered for industrial-grade reliability across wide temperature ranges

Memory IC Applications

• Embedded systems requiring persistent code storage
• Consumer electronics firmware retention
• IoT devices needing compact non-volatile memory
• Industrial control system configuration storage

Memory IC Procurement Notes

Verify the exact package type matches your PCB footprint requirements. Confirm voltage compatibility with your system design. Check RoHS compliance status if required by your manufacturing standards. Ensure the supplier provides genuine GigaDevice products with proper traceability documentation.

Memory IC Selection Notes

Select this component when space constraints require an 8-USON package. Choose this part for applications needing 32Mbit capacity with SPI Quad I/O support. Consider this option for industrial environments requiring extended temperature operation. Verify interface compatibility with your microcontroller's SPI controller capabilities.

Memory IC Part Context

This component belongs to GigaDevice's GD25B series of NOR flash memories. The series offers various capacities and packages for different embedded storage needs. The ENAGR suffix indicates specific packaging and tape/reel configuration. This series is widely used in consumer and industrial electronic devices requiring reliable non-volatile storage.

Memory IC Replacement Considerations

GD25B32ES2GR: Similar capacity but SOP-8 package. GD25B32ETIGR: Similar capacity but SOP-8 package. GD25B32ESIGR: Similar capacity but SOP-8 package. Verify package compatibility before substitution.