Memory IC GD25B32ESIGR product image

GD25B32ESIGR

$0.54
  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:2c4fb87f8b11 Category: Brand:

  
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GD25B32ESIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25B32ESIGR

  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:70µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25B32ESIGR

GD25B32ESIGR

Memory IC Overview

The GD25B32ESIGR is a 32 Mbit Serial NOR Flash memory device manufactured by GigaDevice. It operates within a voltage range of 2.7 V to 3.6 V and supports standard, Dual, and Quad SPI interfaces with a maximum clock frequency of 133 MHz. The device features a uniform sector architecture consisting of 4096 KByte capacity, organized into 256-byte pages, 4K-byte sectors, and 32/64K-byte blocks. It is housed in an SOP-8 package and functions reliably across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI modes for flexible data transfer rates up to 532 Mbits/s.
  • Includes software write protection mechanisms allowing top/bottom block protection and security register locking.
  • Features a unique 128-bit ID for individual device identification and authentication.
  • Enables Execute In Place (XiP) operation to reduce instruction fetch latency.

Memory IC Applications

  • Code storage for microcontrollers requiring direct execution from flash.
  • BIOS or firmware storage in embedded systems.
  • Configuration data storage in industrial control devices.
  • Parameter storage in consumer electronics.

Memory IC Procurement Notes

Verify the specific suffix 'IGR' corresponds to the SOP-8 package and commercial temperature grade (-40°C to +85°C). Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure design compatibility with the 2.7V to 3.6V supply voltage requirements and 133MHz interface speed limitations.

Memory IC Selection Notes

Select this component when a 32 Mbit density is required with uniform sector erase capabilities. It is suitable for designs needing high-speed read performance via Quad SPI and robust data protection features. Consider the SOP-8 package constraints and verify that the operating voltage aligns with the system's power supply rails.

Memory IC Part Context

This part belongs to the GD25B32E series of Dual and Quad Serial Flash memories. The series is designed for applications demanding high reliability and fast program/erase speeds. It complements GigaDevice's broader portfolio of SPI NOR Flash products offering various densities and package options for diverse embedded storage needs.

Memory IC Replacement Considerations

GD25Q32ESIGR

Memory IC FAQ

Is the Quad Enable (QE) bit configurable?

No, the QE bit is permanently set to 1 by default and cannot be changed, ensuring IO2 and IO3 pins are always enabled for Quad operations.

What is the typical standby current consumption?

The typical standby current is 12μA, while the deep power-down current is typically 1μA.

GD25B32ESIGRGD25B32ESIGR
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