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GD25B32ET2GR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25B32ET2GR
- Description：IC FLASH 32MBIT SPI/QUAD 8SOP
- Series：GD25B
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：32Mbit
- Memory Organization：4M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package：8-SOP
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25B32ET2GR
Memory IC Overview
The GD25B32ET2GR is a 32Mbit SPI NOR Flash memory component manufactured by GigaDevice. It features a Quad I/O interface and operates within a supply voltage range of 2.7V to 3.6V. The device utilizes SLC NAND technology and offers a storage organization of 4M x 8 bits. It is designed for surface-mount installation in an 8-SOP package with a width of 3.90mm. The operational temperature range extends from -40°C to +105°C, ensuring reliability across industrial conditions.
Memory IC Feature Summary
- Supports high-speed data transfer via Quad I/O SPI interface
- Non-volatile storage architecture retains data without power
- Industrial-grade thermal stability for demanding environments
Memory IC Applications
- Code storage for embedded systems
- Data logging applications
- Consumer electronics firmware storage
Memory IC Procurement Notes
Verify the specific suffix 'T2GR' against the manufacturer's official datasheet to confirm tape-and-reel packaging and lead-free status. Ensure compatibility with existing PCB footprints for the 8-SOP package. Confirm that the 2.7V-3.6V voltage range aligns with the target system's power rails before finalizing procurement.
Memory IC Selection Notes
Select this component when a 32Mbit capacity is required with Quad SPI support. The 8-SOP package suits space-constrained designs. Verify that the operating temperature range meets the application's environmental requirements. Consider the SLC technology characteristics for endurance and retention needs compared to alternative memory types.
Memory IC Part Context
This part belongs to the GD25B series of SPI NOR Flash memories from GigaDevice. The series targets diverse design requirements with high performance and security features. It complements other densities in the portfolio, offering a solution for code execution and data storage in various electronic devices.
Memory IC Replacement Considerations
Check for direct pin-compatible substitutes within the GD25B family with different density or package options. Verify if older revisions of the GD25B32 series are functionally equivalent. Consult the manufacturer's obsolescence notices for any recommended upgrades.
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