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GD25B512MEB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 512MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25B512MEB2RY
- Description：IC FLSH 512MBIT SPI/QUAD 24TFBGA
- Series：GD25B
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：512Mbit
- Memory Organization：64M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25B512MEB2RY
Memory IC Overview
The GD25B512MEB2RY is a 512 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It features a 64M x 8 organization and supports Single I/O, Quad I/O, QPI, and DTR interfaces with a maximum clock frequency of 133 MHz. The component operates within a voltage range of 2.7 V to 3.6 V and is housed in a 24-TFBGA (6x8) package. It is designed for industrial applications with a temperature range of -40°C to +105°C.
Memory IC Feature Summary
- Supports high-speed data transfer via Single I/O, Quad I/O, QPI, and DTR interface modes.
- Integrated hardware error correction code (ECC) algorithms and CRC checksums for data integrity.
- Provides robust reliability with 100,000 program/erase cycle endurance and extended data retention capabilities.
Memory IC Applications
- Automotive infotainment systems
- Advanced driver assistance systems (ADAS)
- Intelligent cockpit controllers
Memory IC Procurement Notes
Verify the specific suffix B2RY against official datasheets to confirm the exact package dimensions and tape-and-reel specifications. Ensure compatibility with the target system's voltage levels and interface requirements before integration. Cross-reference the manufacturing date code and lot number to verify supply chain authenticity and traceability.
Memory IC Selection Notes
Select this component when a 512 Mbit density is required with a 24-pin TFBGA footprint. It is suitable for designs needing 133 MHz operation and industrial temperature stability. Consider alternative packages like WSON-8 if space constraints differ, or lower voltage variants if the system operates below 2.7 V.
Memory IC Part Context
This part belongs to the GD25B series of automotive-grade SPI NOR Flash memories. The series is AEC-Q100 Grade 1 qualified and ISO 26262:2018 ASIL D certified. It targets high-reliability embedded applications requiring secure and durable code storage in modern vehicle architectures.
Memory IC Replacement Considerations
GD25B512MEYIGR offers similar electrical characteristics but utilizes a WSON-8 package instead of TFBGA-24. Verify pinout compatibility and thermal performance differences before substitution.
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