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GD25B512MEF2RR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 16SOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25B512MEF2RR
- Description：IC FLASH 512MBIT SPI/QUAD 16SOP
- Series：GD25B
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：512Mbit
- Memory Organization：64M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package：16-SOP
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25B512MEF2RR
Memory IC Overview
The GD25B512MEF2RR is a 512 Mbit SPI NOR Flash memory component manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports a maximum clock frequency of 133 MHz. The device features a 64M x 8 memory organization and utilizes an SMD/SMT installation style in a 16-SOP package. It is designed for non-volatile data storage applications requiring reliable performance.
Memory IC Feature Summary
- Supports multiple interface modes including SPI, Quad I/O, QPI, and DTR for flexible system integration.
- Provides hardware reset functionality and write protection capabilities via the WP# pin.
- Includes security registers with OTP locks to protect critical firmware data.
Memory IC Applications
- Consumer electronics firmware storage
- Industrial control system code execution
- Networking equipment boot code retention
Memory IC Procurement Notes
Verify the specific suffix F2RR against official datasheets to confirm packaging details, as distributor listings may vary. Confirm availability status directly with authorized suppliers due to potential supply constraints. Ensure the operating temperature range meets your application requirements before finalizing procurement decisions.
Memory IC Selection Notes
Select this part when a 512 Mbit capacity is required with standard 3V operation. Compare against GD25L series variants if lower voltage support (1.65V-2V) is necessary. Consider package dimensions and thermal characteristics relative to PCB layout constraints during the design phase.
Memory IC Part Context
This component belongs to the GD25B series of SPI NOR Flash memories from GigaDevice. The series targets diverse design requirements with high-performance and security features. It complements other densities in the portfolio ranging from 512Kb to 2Gb for various embedded applications.
Memory IC Replacement Considerations
GD25B512MEFIRR offers similar specifications in a reel package format. GD25B512MEYIGR provides the same core functionality in a WSON-8 package. Verify pin compatibility and electrical parameters before substituting.
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