Memory IC GD25B512MEY2GR product image

GD25B512MEY2GR

$5.53
  • Description:IC FLASH 512MBIT SPI/QUAD 8WSON
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:bb8123872b7f Category: Brand:

  
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GD25B512MEY2GR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25B512MEY2GR

  • Description:IC FLASH 512MBIT SPI/QUAD 8WSON
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:SPI - Quad I/O, QPI, DTR
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25B512MEY2GR

GD25B512MEY2GR

Memory IC Overview

The GD25B512MEY2GR is a 512 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports a maximum clock frequency of 133 MHz. The memory organization is specified as 64 M x 8 bits. The component utilizes an 8-WSON (6x8 mm) surface-mount package with exposed pad. It functions across an industrial temperature range from -40°C to +105°C.

Memory IC Feature Summary

  • Supports standard SPI, Quad I/O, QPI, and DTR interface modes for flexible data transfer.
  • Integrates hardware-based ECC algorithms and CRC checksums for data integrity.
  • Includes security registers with OTP locks and unique ID capabilities.

Memory IC Applications

  • Automotive infotainment systems
  • Advanced Driver Assistance Systems (ADAS)
  • Industrial control units

Memory IC Procurement Notes

Verify the specific suffix against the manufacturer datasheet to confirm exact package dimensions and tape-and-reel specifications. Confirm RoHS compliance status directly with the supplier documentation. Ensure the ordering quantity aligns with the factory packaging quantity requirements. Validate that the intended operating temperature range matches the component's industrial rating.

Memory IC Selection Notes

Select this component when a 512 Mbit density is required in an 8-WSON footprint. It is suitable for designs needing 133 MHz operation at 3.3V logic levels. Consider alternative densities if higher storage capacity is needed. Verify thermal management requirements for the WSON package in enclosed enclosures.

Memory IC Part Context

This part belongs to the GD25B series of SPI NOR Flash memories. The series targets automotive and industrial applications requiring high reliability. It complements other densities in the family, such as 256Mb and 1Gb variants, offering scalable storage solutions for embedded code execution.

Memory IC Replacement Considerations

Check for GD25B512MFY2GR or GD25LB512MEY2GR as potential pin-compatible alternatives. Verify voltage ranges and interface speeds before substitution. Ensure the replacement part meets the same AEC-Q100 qualification standards if used in automotive contexts.

GD25B512MEY2GRGD25B512MEY2GR
$5.53
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