Memory IC GD25B512MEYEGR product image

GD25B512MEYEGR

$4.72
  • Description:IC FLASH 512MBIT SPI/QUAD 8WSON
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:d900d85b1deb Category: Brand:

  
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GD25B512MEYEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25B512MEYEGR

  • Description:IC FLASH 512MBIT SPI/QUAD 8WSON
  • Series:GD25B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:SPI - Quad I/O, QPI, DTR
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25B512MEYEGR

GD25B512MEYEGR

Memory IC Overview

The GD25B512MEYEGR is a 512M-bit (64M-byte) SPI NOR Flash memory device manufactured by GigaDevice. It supports Standard SPI, Quad SPI, QPI, and DTR Quad I/O interfaces with a maximum clock frequency of 133 MHz. The device operates on a single power supply voltage ranging from 2.7V to 3.6V. It features a uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. Key performance metrics include a typical page program time of 0.15ms, sector erase time of 30ms, and block erase times of 0.15s or 0.22s. Data retention is specified at 20 years, with an endurance of 100,000 Program/Erase cycles.

Memory IC Feature Summary

  • Supports high-speed data transfer via Quad I/O up to 532 Mbits/s and DTR Quad I/O up to 720 Mbits/s.
  • Includes advanced security features such as a 128-bit Unique ID and 4K-byte Security Registers with OTP locks.
  • Provides flexible write protection through software commands and hardware WP# pin control.
  • Enables Execute In Place (XIP) operation with continuous read wrap functionality to reduce latency.

Memory IC Applications

  • Code storage for embedded systems requiring high-speed boot operations
  • Firmware storage in consumer electronics and IoT devices
  • Data logging applications needing reliable non-volatile storage
  • Industrial control systems requiring robust data retention

Memory IC Procurement Notes

Verify the specific suffix 'YEGR' against the manufacturer's official ordering information table to confirm package type and temperature range. Ensure compatibility with system voltage levels within the 2.7V to 3.6V operating range. Confirm that the required interface modes (Standard, Quad, QPI, or DTR) are supported by the host controller. Check for any specific revision history updates that may affect command sets or electrical characteristics.

Memory IC Selection Notes

Select this component when a 512M-bit density is required with support for DTR mode for maximum throughput. Consider the 8-WSON package if space constraints align with the 6x8mm footprint. Evaluate the need for hardware reset functionality and write protection schemes before finalizing the design. Ensure the application environment falls within the specified industrial temperature range if applicable.

Memory IC Part Context

The GD25B512ME belongs to the GD25B series of Serial NOR Flash memories from GigaDevice. This series is designed for high-performance code storage applications. The device utilizes SLC NAND technology optimized for NOR-like interface operations. It is part of a broader portfolio offering various densities and interface speeds for diverse embedded memory needs.

Memory IC Replacement Considerations

Check for GD25B512ME variants with different suffixes indicating alternative packages or temperature grades. Verify cross-compatibility with other 512M-bit SPI NOR Flash devices from different manufacturers if supply chain diversification is required. Ensure pinout and command set compatibility before substituting.

Memory IC FAQ

What is the difference between Quad SPI and DTR Quad I/O modes?

Quad SPI transfers data on four I/O lines at the rising edge of the clock. DTR Quad I/O transfers data on both the rising and falling edges of the clock, effectively doubling the data rate compared to standard Quad SPI.

How does the hardware write protection work?

Hardware write protection is enabled by pulling the WP# pin low. When active, it prevents changes to the Block Protect bits and Status Register Protection bits, securing the memory configuration against accidental modification.

Can the device operate in both Standard SPI and QPI modes simultaneously?

No, Standard/Quad SPI mode and QPI mode are exclusive. Only one mode can be active at any given time. The device switches between them using specific Enable/Disable QPI commands.

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