GD25B512MEYJGR

$4.11

Description：IC FLASH 512MBIT SPI/QUAD 8WSON
Series：GD25B
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)

SKU:81e7e8ba6450 Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25B512MEYJGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25B512MEYJGR

Description：IC FLASH 512MBIT SPI/QUAD 8WSON
Series：GD25B
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR (SLC)
Memory Size：512Mbit
Memory Organization：64M x 8
Memory Interface：SPI - Quad I/O, QPI, DTR
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 105°C (TA)
Mounting Type：Surface Mount
Package / Case：8-WDFN Exposed Pad
Supplier Device Package：8-WSON (6x8)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25B512MEYJGR

GD25B512MEYJGR

Memory IC Overview

The GD25B512MEYJGR is a 512M-bit (64M-byte) SPI NOR flash memory from GigaDevice, housed in an 8-WSON package. It supports standard SPI, Quad SPI, QPI, and DTR modes with a maximum clock frequency of 133 MHz. Operating on a single 2.7V to 3.6V supply, it features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. The device includes hardware write protection via the WP# pin, software block protection, and a dedicated RESET# pin.

Memory IC Feature Summary

Supports high-speed data transfer through Quad I/O and Double Transfer Rate (DTR) modes alongside standard SPI and QPI interfaces.
Provides flexible data protection mechanisms including individual block locking, global sector protection, and hardware write protection via the WP# pin.
Features a dedicated hardware reset function accessible via the RESET# pin for reliable system recovery.

Memory IC Applications

Code storage for embedded systems requiring execute-in-place (XIP) capabilities
Firmware storage for IoT devices and consumer electronics
Data logging applications needing reliable non-volatile retention

Memory IC Procurement Notes

Verify the specific suffix 'YJGR' against the manufacturer's official ordering guide to confirm the exact temperature range and packaging specifications. Ensure compatibility with the target PCB footprint for the WSON-8 package. Confirm that the design supports the required voltage levels and interface modes before finalizing procurement.

Memory IC Selection Notes

Select this component when a 512M-bit density is required with support for advanced high-speed interfaces like DTR and QPI. It is suitable for designs needing robust security features such as individual block protection and hardware write locks. Consider the operating temperature range associated with the 'J' suffix during selection.

Memory IC Part Context

This part belongs to the GD25B512ME series, which offers uniform sector architecture for simplified memory management. The series is designed for high-performance applications requiring fast read speeds and reliable data retention. It complements other GigaDevice flash products by providing a balance of capacity, speed, and security features.