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GD25B512MFYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
The GD25B512MFYIGR is a 512 Mbit NOR flash memory device manufactured by GigaDevice. It features a storage organization of 64 M x 8 bits and supports Dual/Quad SPI interfaces with a maximum clock frequency of 133 MHz. The component operates within a supply voltage range of 2.7 V to 3.6 V, with a maximum active read current of 35 mA. It is housed in an 8-pin WSON package designed for surface mount technology. The device functions reliably across an industrial temperature range from -40°C to +85°C.
Verify the specific suffix 'FYIGR' against the official manufacturer datasheet to confirm package dimensions and tape-and-reel specifications. Ensure compatibility with existing PCB footprints for the WSON-8 form factor. Confirm RoHS compliance status through the latest regulatory documentation provided by GigaDevice before finalizing procurement orders.
Select this component when a 512 Mbit density is required with a compact WSON-8 footprint. It is suitable for designs needing Dual/Quad SPI support without the complexity of DTR modes found in other variants. Consider the -40°C to +85°C operating range for general industrial or commercial environments rather than extended automotive grades.
This part belongs to the GD25B series of SPI NOR flash memories from GigaDevice. The series targets embedded applications requiring moderate density with high reliability. Unlike automotive-grade variants, this specific model focuses on commercial and industrial segments, offering a balance of performance and cost-effectiveness for standard consumer and IoT electronics.
Check for GD25B512MEYIGR if DTR mode support is needed. Verify pinout compatibility with GD25Q512E series devices for potential drop-in replacements in similar voltage and interface configurations.
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