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GD25B64CSIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.
The GD25B64CSIGR is a 64 Mbit NOR flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and features an SPI interface with a maximum clock frequency of 120 MHz. The memory organization is specified as 8 M x 8 bits with an 8-bit data bus width. Active read current is rated at a maximum of 20 mA. The component is housed in an SOP-8 package (208 mil) and supports industrial operating temperatures from -40°C to +85°C. It is supplied in tape and reel packaging.
Verify the specific suffix 'GR' confirms tape and reel packaging configuration. Confirm the 'C' series designation aligns with required performance specifications. Check manufacturer lifecycle status as NRND indicates it is not recommended for new designs. Validate humidity sensitivity level requirements against assembly process capabilities. Ensure SOP-8 208mil footprint matches PCB layout constraints.
Select this part when a 64 Mbit density is required with industrial temperature ratings. Compare against GD25B64CWIGR if WSON-8 packaging is preferred over SOP-8. Consider GD25B64ESIGR if newer product generation availability is critical. Verify voltage compatibility with 2.7 V to 3.6 V system rails. Assess interface speed requirements against the 120 MHz maximum clock limit.
This component belongs to the GD25B64C series of SPI NOR flash memories. The series offers 64 Mbit capacity with support for various package options including SOP-8 and WSON-8. It targets applications requiring moderate speed and reliability in industrial and consumer environments. The family emphasizes standard SPI compatibility with enhanced security features.
GD25B64CWIGR shares identical electrical specifications but utilizes WSON-8 packaging instead of SOP-8. GD25B64ESIGR represents a newer generation within the same capacity class. Verify pinout compatibility and package dimensions before substitution. Confirm lifecycle status differences between C and E series variants.
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