GD25B64EWIGR

$1.21

Description：IC FLASH 64MBIT SPI/QUAD 8WSON
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:25fad91c1d97 Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25B64EWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25B64EWIGR

Description：IC FLASH 64MBIT SPI/QUAD 8WSON
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR),Cut Tape (CT)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR (SLC)
Memory Size：64Mbit
Memory Organization：8M x 8
Memory Interface：SPI - Quad I/O
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：70µs, 2.4ms
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：8-WDFN Exposed Pad
Supplier Device Package：8-WSON (5x6)
Access Time：7 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25B64EWIGR

GD25B64EWIGR

Memory IC Overview

The GD25B64EWIGR is a 64 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with Quad I/O support and operates within a supply voltage range of 2.7 V to 3.6 V. The component supports a maximum clock frequency of 133 MHz and features an access time of 7 ns. It is housed in an 8-WSON (5x6 mm) package designed for surface mount technology. The device maintains reliable operation across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

Supports standard SPI and Quad I/O modes for flexible data transfer
Provides high-speed read performance up to 133 MHz
Features uniform sector architecture for consistent erase and program operations

Memory IC Applications

Code storage in embedded systems
Firmware storage for microcontrollers
Data logging applications

Memory IC Procurement Notes

Verify the specific suffix against official datasheets to confirm package type and operating temperature range. Ensure compatibility with system voltage requirements, as this model requires a minimum of 2.7 V. Confirm moisture sensitivity level handling procedures during assembly to prevent damage. Cross-reference manufacturer part numbers with distributor listings to avoid obsolete or non-compliant variants.

Memory IC Selection Notes

Select this component when a 64 Mbit capacity is required with a compact WSON-8 footprint. It is suitable for designs needing fast boot times due to its 133 MHz speed capability. Consider this option if the application environment falls within the industrial temperature range of -40°C to +85°C. Verify that the host controller supports SPI Quad I/O commands to utilize the full bandwidth potential of the device.

Memory IC Part Context

This part belongs to the GD25B64E series of NOR flash memories from GigaDevice. The series is characterized by its use of SLC NAND-like reliability in a NOR architecture, offering byte-level access. It is distinct from higher-density models like the GD25Q64E which may share similar pinouts but differ in internal organization or feature sets. The 'WIGR' suffix typically denotes the WSON-8 package and tape-and-reel packaging format.