Memory IC GD25D05EEIGR product image

GD25D05EEIGR

$0.19
  • Description:IC FLASH 512KBIT SPI/DUAL 8USON
  • Series:GD25D
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:e31ea7c9f689 Category: Brand:

  
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GD25D05EEIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512KBIT SPI/DUAL 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25D05EEIGR

  • Description:IC FLASH 512KBIT SPI/DUAL 8USON
  • Series:GD25D
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:512Kbit
  • Memory Organization:64K x 8
  • Memory Interface:SPI - Dual I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XFDFN Exposed Pad
  • Supplier Device Package:8-USON (3x2)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25D05EEIGR

GD25D05EEIGR

Memory IC Overview

The GD25D05EEIGR is a 512Kbit SPI NOR Flash memory IC manufactured by GigaDevice. It features a 64K x 8 organization and supports Dual SPI interfaces with a maximum clock frequency of 104 MHz. The device operates within a supply voltage range of 2.7V to 3.6V, drawing a maximum active read current of 6 mA. It is housed in an 8-USON package and is designed for non-volatile data storage applications requiring high performance and reliability.

Memory IC Feature Summary

  • Supports Dual SPI interface for enhanced data throughput
  • High-speed operation with up to 104 MHz clock frequency
  • Compact surface-mount packaging suitable for space-constrained designs

Memory IC Applications

  • Consumer electronics code storage
  • Industrial control systems
  • Internet of Things (IoT) devices

Memory IC Procurement Notes

Verify the specific suffix 'EEE' against the requested 'EIGR' designation, as datasheets indicate variations in temperature ranges and packages within the GD25D05 family. Confirm availability status directly with authorized distributors due to potential supply constraints. Ensure the selected variant matches the required operating temperature and package dimensions for the target PCB layout.

Memory IC Selection Notes

Select this component when a 512Kbit capacity is sufficient for firmware or configuration data. The Dual SPI mode offers a balance between pin count and speed compared to standard SPI. Consider the 8-USON package size for compact assemblies. Verify that the 2.7V minimum voltage aligns with the system's power rail stability under all load conditions.

Memory IC Part Context

This part belongs to the GD25D series of SPI NOR Flash memories from GigaDevice. The series targets diverse design requirements with densities ranging from 512Kb to higher capacities. These devices are engineered for general-purpose embedded applications, offering a cost-effective solution for code execution and data retention in consumer and industrial markets.

Memory IC Replacement Considerations

GD25D05EEEGR: Similar 512Kbit capacity and interface, but verify if the extended temperature range (-40°C to 125°C) is required or if the standard range suffices.

GD25D05EEIGRGD25D05EEIGR
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